Vertical 3D Memory Technologies (eBook)
368 Seiten
Wiley (Verlag)
978-1-118-76046-8 (ISBN)
Dr Betty Prince has over 30 years' experience in the semiconductor industry having worked with Texas Instruments, N.V. Philips, Motorola, R.C.A., and Fairchild and is currently CEO of Memory Strategies International. She has authored four books and served from 1991-1994 on the Technical Advisory Board of IEEE Spectrum magazine. She is a Senior Life Member of the IEEE and served as an IEEE SSCS Distinguished Lecturer and on the Program Committee of the IEEE Custom Integrated Circuit conference. She was founder of the JEDEC JC-16 Interface Standards Committee and was active for many years on the JC-42 Memory Committee where she was co-chair of the SRAM standards group. She has been U.S. representative to the IEC SC47A WG3 Memory Standards Committee. Dr Prince has served on the Technical Advisory Board of several memory companies and has been on the Board of Directors of Mosaid Technologies. She holds patents in the memory, processor and interface areas and has degrees in Physics, Math, and Finance with doctoral dissertation in fractal modeling.
"In summary, Betty Prince has produced a piece of work that is timely and will undoubtedly become a classic text for 3D memory technologies." (3dincites.com, 30 September 2014)
"As the semiconductor memory industry moves to the third dimension a plethora of competing technologies has arisen each claiming to be the logical, lucrative successor to existing two dimensional versions. The very breadth of these new technologies can be confusing even to experienced industry professionals. Dr Prince's book appears at the right time to remove this confusion by explaining each technology's structure, function and potential advantages in a way that is accessible to both interested spectators and those working in the industry. It provides a welcome solid foundation to anyone interested in understanding the various technologies vying for success in this migration."
--Andrew Walker, Schiltron Corporation, USA
"This is a great review on the current state-of-the-art in the highly topical subject of vertical 3D memories. It comprises the challenges and current solutions of 3D memory integration with respective to different memory technologies. It is a highly valuable resource for researchers and engineers in the field of memory technology."
--Dr. Stephan Menzel, Forschungszentrum Jülich (PGI-7), Germany
"... one to consider if you want to bring yourself up to speed on recent research behind today's and tomorrow's 3D memory technologies. The book provides capsule summaries of over 360 papers and articles from scholarly journals organized into sections of related technologies to provide an invaluable reference on a particular 3D technology. It's a useful tool for locating research covering any of the numerous 3D technologies that are now finding their way into early production."
--Jim Handy, TheMemoryGuy.com, OBJECTIVE ANALYSIS Semiconductor Market Research, USA
Erscheint lt. Verlag | 13.8.2014 |
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Sprache | englisch |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
Schlagworte | Circuit Theory & Design • Electrical & Electronics Engineering • Elektrotechnik u. Elektronik • Halbleiter • Leistungselektronik • Power Electronics • Schaltkreise - Theorie u. Entwurf • semiconductors • Speicher |
ISBN-10 | 1-118-76046-8 / 1118760468 |
ISBN-13 | 978-1-118-76046-8 / 9781118760468 |
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