Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications
Springer-Verlag New York Inc.
978-1-4613-7325-4 (ISBN)
I High Frequency Issues.- 1 Tutorial On Microwave Concepts.- 2 The Smith Chart and S-Parameters.- II Electrical Modeling of Packages.- 3 Equivalent Circuit Models.- 4 Creating Models From Measurements.- 5 Creating a Model Using Em Simulators.- III Thermal Modeling.- 6 Basics of Thermal Analysis.- 7 Quick Thermal Analysis.- 8 Finite Element Analysis.- 9 Computational Fluid Dynamics.- 10 Transient Thermal.- 11 Thermal Measurements.- IV Processing Issues With Packaging Gaas High Frequency Components.- 12 Package Families for Wireless.- 13 Optimizing Electrical Performance.- 14 Production Process Issues.- 15 Die Attach Issues.- Appendix A Electrical Conductivities of Packaging Materials.- Appendix B Dielectric Properties of Packaging Materials.- Appendix C Thermal Conductivities of Packaging Materials.- Appendix D Thermal Modeling Software And Information.- Appendix E Thermal Analysis Equipment And Materials.- Appendix F Electromagnetic Simulator Software.- Appendix G Electrical Probing Tools.- Appendix H Circuit Simulator Software.
Reihe/Serie | Electronic Packaging and Interconnects ; 2 |
---|---|
Zusatzinfo | 62 Illustrations, black and white; XIV, 234 p. 62 illus. |
Verlagsort | New York, NY |
Sprache | englisch |
Maße | 155 x 235 mm |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
ISBN-10 | 1-4613-7325-5 / 1461373255 |
ISBN-13 | 978-1-4613-7325-4 / 9781461373254 |
Zustand | Neuware |
Haben Sie eine Frage zum Produkt? |
aus dem Bereich