Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research
World Scientific Publishing Co Pte Ltd (Verlag)
978-981-4579-78-0 (ISBN)
Foreword on Professor Avram Bar-Cohen's Contribution to the Electronics Packaging Field; A Review of Cooling Road Maps for 3D Chip Packages; Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks; Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency; Energy Reduction and Performance Maximization Through Improved Cooling; Optimal Choice of Heat Sinks From an Industrial Point of View with a Focus on LED Applications; Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems; Recent Advance in Thermoelectric Devices for Electronics Cooling; Energy Efficient Solid-State Cooling for Hot Spot Removal; An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges; Estimation of Cooling Performance of Phase Change Material (PCM) Module; Optimization Under Uncertainty for Electronics Cooling Design; Hydrophilic CNT-Sintered Copper Composite Wick for Enhanced Cooling; A Cabinet Level Thermal Test Vehicle to Evaluate Hybrid Double-Sided Cooling Schemes; Energy Efficiency and Reliability Risk Mitigation of Data Centers Through Prognostics and Health Management; Damage Pre-Cursors Based Assessment of Accrued Thermo-Mechanical Damage and Remaining Useful Life in Field Deployed Electronics.
Reihe/Serie | Wspc Series In Advanced Integration And Packaging ; 3 |
---|---|
Verlagsort | Singapore |
Sprache | englisch |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
ISBN-10 | 981-4579-78-5 / 9814579785 |
ISBN-13 | 978-981-4579-78-0 / 9789814579780 |
Zustand | Neuware |
Haben Sie eine Frage zum Produkt? |
aus dem Bereich