Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability
Seiten
2014
Springer-Verlag New York Inc.
978-1-4614-9265-8 (ISBN)
Springer-Verlag New York Inc.
978-1-4614-9265-8 (ISBN)
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Introduction.- Interconnection : The Joint.- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.- Microstructure Development; Solidification and Isothermal Aging.- Thermal Cycling Performance.- Mechanical Stability and Performance.- Chemical and Environment Attack.- Challenges in Future Generation Interconnects: Microstructure Again.
| Zusatzinfo | 81 Illustrations, color; 70 Illustrations, black and white; XIII, 253 p. 151 illus., 81 illus. in color. |
|---|---|
| Verlagsort | New York, NY |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Technik ► Maschinenbau | |
| Schlagworte | electromigration • lead-free electronics • lead-free solder alloys • lead-free soldering • lead free soldering standards • solder joint reliability • surface mount assembly • tin whiskering |
| ISBN-10 | 1-4614-9265-3 / 1461492653 |
| ISBN-13 | 978-1-4614-9265-8 / 9781461492658 |
| Zustand | Neuware |
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