Nano and Micromachining (eBook)

J. Paul Davim works for KINNSYS, Brussels, Belgium. Mark Jackson works for Jackson Ashcroft Associates, London, UK.

Preface.

Chapter 1. Nanoscale Cutting (Rüdiger RENTSCH).

1.1. Introduction.

1.2. Basic elements of molecular dynamics modeling.

1.3. Design and requirements for state-of-the-art MD cutting process simulations.

1.4. Capabilities of MD for nanoscale material removal process analysis.

1.5. Advances and recent developments in material removal process simulation.

1.6. Summary and outlook.

1.7. References.

Chapter 2. Ductile Mode Cutting of Brittle Materials: Mechanism, Chip Formation and Machined Surfaces (Xiaoping LI).

2.1. Introduction.

2.2. The mechanism of ductile mode cutting of brittle materials.

2.3. The chip formation in cutting of brittle materials.

2.4. Machined surfaces in relation to chip formation mode.

2.5. References.

Chapter 3. Diamond Tools in Micromachining (Waqar AHMED, Mark J. JACKSON and Michael D. WHITFIELD).

3.1. Introduction.

3.2. Diamond technology.

3.3. Preparation of substrate.

3.4. Modified HFCVD process.

3.5. Nucleation and diamond growth.

3.6. Deposition on complex substrates.

3.7. Diamond micromachining.

3.8. Conclusions.

3.9. References.

Chapter 4. Conventional Processes: Microturning, Microdrilling and Micromilling (Wit GRZESIK).

4.1. Introduction.

4.2. Microturning.

4.3. Microdrilling.

4.4. Micromilling.

4.5. Product quality in micromachining.

4.6. References.

Chapter 5. Microgrinding and Ultra-precision Processes (Mark J. JACKSON and Michael D. WHITFIELD).

5.1. Introduction.

5.2. Micro and nanogrinding.

5.3. Nanogrinding tools.

5.4. Conclusions.

5.5. References.

Chapter 6. Non-Conventional Processes: Laser Micromachining (Grant M. ROBINSON and Mark J. JACKSON).

6.1. Introduction.

6.2. Fundamentals of lasers.

6.3. Laser microfabrication.

6.4. Laser nanofabrication.

6.5. Conclusions.

6.6. References.

Chapter 7.Evaluation of Subsurface Damage in Nano and Micromachining (Jianmei ZHANG, Jiangang SUN and Zhijian PEI).

7.1. Introduction.

7.2. Destructive evaluation technologies.

7.3. Non-destructive evaluation technologies.

7.4. Acknowledgements.

7.5. References.

Chapter 8. Applications of Nano and Micromachining in Industry (Jiwang YAN).

8.1. Introduction.

8.2. Typical machining methods.

8.3. Applications in optical manufacturing.

8.4. Semiconductor and electronics related applications.

8.5. Summary.

8.6. Acknowledgements.

8.7. References.

List of Authors.

Index.