Practical Guide to RF-MEMS

Jacopo Iannacci is Researcher in MEMS technology at the Fondazione Bruno Kessler - FBK in Trento, Italy, where he focuses on (compact) modeling, design, optimization, integration, packaging and testing for reliability of MEMS/RF-MEMS devices and networks for sensors/actuators, energy harvesting and telecommunication systems. He received the PhD in Information Technology from the ARCES Research Center of the University of Bologna, Italy, and worked as Visiting Researcher at the DIMES Technology Center of the Technical University of Delft, the Netherlands, on development of packaging and integration solutions for RF-MEMS devices. Jacopo Iannacci authored and co-authored numerous scientifi c contributions for international journals and conference proceedings, as well as books and several book chapters in the fi eld of MEMS and RFMEMS technology.

PREFACE

RF-MEMS APPLICATIONS AND THE STATE OF THE ART
Introduction
A Brief History of MEMS and RF-MEMS from the Perspective of Technology
RF-MEMS Lumped Components
RF-MEMS Complex Networks
Modeling and Simulation of RF-MEMS Devices
Packaging of RF-MEMS
Brief Overview of Exploitation of RF-MEMS in RF Systems
Conclusions

THE BOOK IN BRIEF
Introduction
A Brief Introduction to the FBK RF-MEMS Technology
An RF-MEMS Series Ohmic Switch (Dev A)
RF-MEMS Capacitive Switches/Varactors
Conclusions

DESIGN
Introduction
Design Rules of the Fondazione Bruno Kessler RF-MEMS Technology
Design of an RF-MEMS Series Ohmic Switch (Dev A)
Generation of 3D Models Starting from the 2D Layout
Conclusions

SIMULATION TECHNIQUES (COMMERCIAL TOOLS)
Introduction
Static Coupled Electromechanical Simulation of the RF-MEMS Ohmic Switch (Dev A) in ANSYS Multiphysics
Modal Analysis of the RF-MEMS Capacitive Switch (Dev B2) in ANSYS Multiphysics
Coupled Thermoelectromechanical Simulation of the RF-MEMS Ohmic Switch with Microheaters (Dev C) in ANSYS Multiphysics
RF Simulation (S-parameters) of the RF-MEMS Variable Capacitor (Dev B1) in ANSYS HFSS?
Conclusions

ON-PURPOSE SIMULATION TOOLS
Introduction
MEMS Compact Model Library
A Hybrid RF-MEMS/CMOS VCO
Excerpts of Verilog-A Code Implemented for MEMS Models
Conclusions

PACKAGING AND INTEGRATION
Introduction
A WLP Solution for RF-MEMS Devices and Networks
Encapsulation of RF-MEMS Devices
Fabrication Run of Packaged Test Structures
Electromagnetic Characterization of the Package
Influence of Uncompressed ACA on the RF Performance of Capped MEMS Devices
Conclusions

POSTFABRICATION MODELING AND SIMULATIONS
Introduction
Electromechanical Simulation of an RF-MEMS Varactor (Dev B2) with Compact Models
RF Modeling of an RF-MEMS Varactor (Dev B2) with a Lumped Element Network
Electromechanical Modeling of an RF-MEMS Series Ohmic Switch (Dev A) with Compact Models
Electromagnetic Modeling and Simulation of an RF-MEMS Impedance- Matching Network (Dev E) for a GSM CMOS Power Amplifier
Electromagnetic Simulation of an RF-MEMS Capacitive Switch (Dev B1) in ANSYS HFSS
Electromagnetic Simulation of a MEMS-Based Reconfigurable RF Power Attenuator (Dev D) in ANSYS HFSS
Conclusions

APPENDIX A RIGID PLATE ELECTROMECHANICAL TRANSDUCER (COMPLETE MODEL)
Introduction
Mechanical Model of the Rigid Plate with Four DOFs
Extension of the Mechanical Model of the Rigid Plate to Six DOFs
Contact Model for Rigid Plates with Four and Six DOFs
Electrostatic Model of the Rigid Plate
Electrostatic Model of the Plate with Holes
Electrostatic Model of the Fringing Effect
Viscous Damping Model
Conclusions

APPENDIX B FLEXIBLE STRAIGHT BEAM (COMPLETE MODEL)
Mechanical Model of the Flexible Beam with Two Degrees of Freedom
Mechanical Model of the Flexible Beam with 12 DOFs
Complete Mechanical Model of the Euler Beam with 12 DOFs
ElectrostaticModel of the Euler Beamwith 12 DOFs
Viscous Damping Model
Conclusions

INDEX