Metallized Plastics 3

I. Metallization Techniques and Properties of Metal Deposits.- The Application of a Polypyrrole Precoat for the Metallization of Printed Circuit Boards.- Photoselective Circuitization of Dielectrics Via Electroless Plating of Metals.- Plasma-Induced Deposition of Copper Films.- The Effects of Substrate Functional Groups on Conventional and Novel E1ectroless Catalysts.- Laser Speckle Detection of Surface Morphology in Molded Plastic Parts.- Development of a Generic Method to Metallize Plastics.- Palladium and Aluminum Thin Film Deposition on Thermally Sensitive Substrates from Organometallic Complexes.- Application of Metallized Plastic Electrodes for Electrowinning of Metals.- II. Investigation of Interfacial Interactions.- Model Studies of the Interface Between Metals and Polyimides.- Scanning Tunneling Microscopy of Metal/Polymer Interfaces.- “In Situ” XPS Investigation of Polymers Metallized by Evaporation.- Model Systems for the Cr/Polyimide Interface.- Interactions of Deposited Copper on COOH of 11-Mercaptoundecanoic Acid: An XPS Study.- XPS Investigation of the Interfacial Chemistry of Evaporated Silver on Plasma-Modified Polystyrene.- The Chemistry of Metal/Polymer Interface Formation: Relevance to Adhesion.- III. Plastic Surface Modifications.- A Study of Metallized Thermoplastic Films Following Gas Plasma Treatment.- Influence of Surface Treatments on the Metallization of Thermostable Polymers.- Oxygen Plasma Treatment of Fluorinated Polyimide: An X-ray Photoelectron Spectroscopy Study.- A Static SIMS Study of the Chemical Modifications Induced by Plasma and Flame Treatments at the Surface of Polyolefins.- Aluminium Metallization of Polypropylene Films Pretreated by a N2 or NH3 Nonequilibrium Plasma. Study of the Interface and Adhesion Measurements.-Aluminum Metallization of Polyimide Substrate.- IV. Adhesion Aspects of Metallized Plastics.- Adhesion Enhancement Using Ion Processing: Metallized Plastics.- The Influence of the Pretreatment on the Adhesion of Metallic Coatings on Plastics.- Effect of the Polymeric Substrate Temperature on the Adhesion and Morphology of Metal Layers.- An Electrochemical Means of Probing a Metal/Polymer Interface- -A Method for Deducing Mechanical and Chemical Adhesion Components.- Measurement and Control of Interface Strength and Mechanical Properties of Coatings by Laser Spallation Experiment.- The Adhesion Strength of Metal/Polyimide and Polyimide/Silicon Interfaces as Determined by the Blister Test.- Non-destructive Evaluation of Adhesion at Metal-Insulator Interfaces Based on Extremely-Low-Frequency Dielectric Spectroscopy.- About the Contributors.