Advanced Electronic Packaging
John Wiley & Sons Inc (Verlag)
978-0-7803-4700-7 (ISBN)
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"Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With ADVANCED ELECTRONIC PACKAGING, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.
About the Editor William D. Brown is the associate dean for research in the College of Engineering and a professor in the Department of Electrical Engineering at the University of Arkansas. Since 1991, he has been actively involved with the High Density Electronics Center (HiDEC) at the University of Arkansas - a center dedicated to advancing the state of the art of electronic packaging materials and technologies - in particular, multichip module technologies. Dr. Brown currently serves on the Executive Committee of the Board of Directors of the Electrochemical Society. In 1996, he received the Thomas D. Callinan Award by the Dielectric Science and Technology Division of the Electrochemical Society in recognition of outstanding contributions to the chemistry and physics of dielectric materials. He has published over 180 technical journal and proceedings articles, has contributed to eight books, and holds four U.S. patents. His research interests include electronic packaging technology; semiconductor materials (focusing on dielectrics) and devices; and solid--state and semiconductor physics. He holds memberships in IEEE, IMAPS, AVA, MRS, and ASEE.
List of Contributors; List of Acronyms; Preface; Introduction and Overview of Microelectronics Packaging - W. Brown; Microelectronics Packaging Materials and Applications - W. Brown; Electrical Design Considerations - S. Ang; Modeling and Simulation - L. Schaper; Thermal Design and Management of Electronics - R. Couvillion; Mechanical Design Considerations - W. Schmidt; Packaging Trade-Offs and Decisions - L. Schaper; Computer-Aided Engineering and Design - D. Andrews, et al; Processing Technologies in Microelectronic Packaging - H. Naseem; Materials and Processing Considerations - S. Ang & W. Brown; Reliability Considerations - R. Ulrich; Testing and Qualification - S. Kolluru & D. Berleant; Mainframe Packaging: The Thermal Conduction Module (TCM) - T. Lenihan; An Industry Perspective on MCM-D - J. Demmin; Automotive Multichip Modules - R. Johnson & J. Evans; Analyticaln Techniques for Materials Characterization - S. Nasrazadani, et al; Cost Considerations - E. Malstrom; Advances Topics and Future Trends in MCM Technology - J. Brewer, et al; Index; About the Editor.
| Erscheint lt. Verlag | 27.10.1998 |
|---|---|
| Reihe/Serie | Microelectronics Systems S. |
| Verlagsort | New York |
| Sprache | englisch |
| Maße | 187 x 262 mm |
| Gewicht | 1588 g |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| ISBN-10 | 0-7803-4700-5 / 0780347005 |
| ISBN-13 | 978-0-7803-4700-7 / 9780780347007 |
| Zustand | Neuware |
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