Ceramic Integration and Joining Technologies (eBook)

Mrityunjay Singh, PhD, FASM, FACerS, FAAAS, is Chief Scientist at Ohio Aerospace Institute, NASA Glenn Research Center, and is actively involved in various activities related to processing, manufacturing, joining and attachment technologies. He is Academician of World Academy of Ceramics and Governor of Acta Materialia, Inc. He has authored or coauthored more than two hundred thirty publications, edited forty two books/journal volumes, and holds several patents and technology transfers to industries. He is recipient of numerous (more than forty) national and international awards from all over the world including four R&D 100 awards, NASA Public Service Medal, and NASA Exceptional Space Act Award for outstanding and extraordinary contributions to various NASA programs. Tatsuki Ohji, PhD, FACerS, is the Prime Senior Research Scientist at Japan's National Institute of Advanced Industrial Science and Technology (AIST). His research interests include characterization of ceramics, ceramic composites and porous materials, design of advanced ceramics, and green ceramic manufacturing. He has authored or coauthored more than 320 scientific papers and nine books, and holds more than forty patents. He is a fellow of the American Ceramic Society, Academician of the World Academy of Ceramics, a Governor of Acta Materialia, Inc., and editorial board member of many international journals. Rajiv Asthana, PhD, FASM, is a professor at the University of Wisconsin-Stout where he teaches in the manufacturing engineering and engineering technology programs. His research interests include ceramic/metal joining, high-temperature capillarity and cast metal-matrix composites. He is the author or coauthor of four books and 150 refereed papers, an Associate Editor of Journal of Materials Engineering & Performance, guest editor and editorial board member of several refereed journals, and a fellow of ASM International. Sanjay Mathur, PhD, is professor at the Institute of Inorganic Chemistry at the University of Cologne, Germany. The major research thrust of his group include chemical synthesis of functional nanostructures and their processing for product and device applications. He was an Alexander von Humboldt Fellow at the Saarland University, where he accomplished his Habilitation. He has authored or coauthored over 150 publications, edited a book, holds several patents, and is and Associate Editor of International Journal of Applied Ceramic Technology and Nanomaterials.

Introduction.

1. Ceramic integration across length scales: Technical issues, challenges, and opportunities (M. Singh, T. Ohji, R. Asthana and S. Mathur).

Science and Technology for Macro-Scale Integration.

2. Ceramic component integration by advanced brazing technologies(Jolanta Janczak-Rusch).

3. Joining and integration issues of ceramic matrix composites for nuclear industry (Monica Ferraris, Milena Salvo, Valentina Casalegno).

4. Air Brazing: A New Method of Ceramic-Ceramic and Ceramic-Metal Joining (K. S. Weil, J. T. Darsell, J. Y. Kim).

5. Diffusion bonding of silicon carbide as an enabling technology for the fabrication of complex-shaped ceramic components (Michael C. Halbig, Mrityunjay Singh).

6. Joining and integration of C/C composite to metals for thermal management applications (Mrityunjay Singh, Rajiv Asthana).

7. Contact interaction in carbon-metal systems for joining and integration (V. M. Oerevertailo, O. B. Loginova).

Integration Issues in Energy Generation and Device Fabrication.

8. Integration Technologies for Ferrites and Power Inductors in Ceramic Circuit Boards (Richard Matz).

9. Oxide Thermoelectric Power Generation (Ryoji Funahashi, Saori Urata, Atsuko Kosuga, Delphine Flahaut).

10. Integration technologies for solid oxide fuel cells (SOFC) and other electrochemical reactors (Yoshinobu Fujishiro, Toshio Suzuki, Toshiro Yamaguchi, Koichi Hamamoto, Masanobu Awano, Nigel Sammes).

11. Integration technologies for sensors (Woosuck Shin, Maiko Nishibori, Ichiro Matsubara).

12. On-chip integration of functional hybrid materials and components in nanophotonics and optoelectroincs (Talha Erdem, Hilmi Volkan Demir).

13. Integration of Multifunctional Properties in Thermal Barrier Coatings by Chemical Vapor Deposition (Takashi Goto).

14. The Changing physics in metal interconnect reliability (Cher Ming Tan, Yuejin Hou).

15. Integration Issues of Barium Strontium Titanate Thin Film Tunable Microwave Applications (Askok Kumar, Supriya Ketkar, Venkataraman Gurumurthy).

16. Aerosol Depostion (AD) integration techniques and its application to "On-Demand MEMS" (Jun Akedo).

Nano and Bio Integration.

17. Advances in nano-integration methodologies: Patterning, positioning and self-assembly (Yoshitake Masuda, Kunihito Koumoto.

18. Integration of Nanowires in New Devices and Circuit Architectures: Challenges and Recent Developments (F. Hernández-Ramírez, J. D. Prades, A Romano-Rodriguez, S. Barth, H. Shen, S. Smathur).

19. Integrating Diamond-like carbon into Nanostructure Designs (Fabricating Micro and Nanoscale Architectures of Diamond-like Carbon Films (Xijun Li, Daniel H. C. Chua).

20. Synthesis, Properties, Integration and Applications of Vertically Aligned Ceramic Nanostructures (D. Pliszka, S. Sundarrajan, S. Ramakrishna).

21. Nanointegration based on thin film technology (C. Jin, W. Wei, R. Aggarwal, R. J. Narayan).

22. Mass-manufacturable Nonowire Integration: Challenges and Recent Developments (Ataur Sarkar, M. Saif Islam).

23. Usability of Inkjet Printing Technology and Nanometarials in Electrical Interconnections, Electronic Packaging, and System Integration for Microelectronics Applications (Umur Caglar, Ville Pekkanen, Jani Valkama, Pauliina Mansikkamäki, Jussi Pekkanen).

24. Bio-integration of prosthetic devices (Masakazu Kawashita, Toshiki Miyazaki, Chikara Ohtsuki).