Multi-Chip Module Test Strategies
Springer-Verlag New York Inc.
978-1-4613-7798-6 (ISBN)
Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain.
Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Fundamentals of MCM Testing and Design-for-Testability.- Die Level Testing.- Known Good Die.- Substrate Testing.- A Survey of Test Techniques for MCM Substrates.- Smart Substrate MCMs.- Electron Beam Probing—A Solution for MCM Test and Failure Analysis.- Module Level Test.- MCM Test Strategy Synthesis from Chip Test and Board Test Approaches.- Designing “Dual Personality” IEEE 1149.1 Compliant Multi-Chip Modules.- An Effective Multi-Chip BIST Scheme.- MCM Test Applications.- Design-for-Test in a Multiple Substrate Multichip Module.- A Test Methodology for High Performance MCMs.- Module Level Diagnosis.- A Formalization of the IEEE 1149.1-1990 Diagnostic Methodology as Applied to Multichip Modules.- Multichip Module Diagnosis by Product-Code Signatures.- Simulation Techniques for MCMs.- Simulation Techniques for the Manufacturing Test of MCMs.- MCM Test Economics.- Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die.
Erscheint lt. Verlag | 4.10.2012 |
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Reihe/Serie | Frontiers in Electronic Testing ; 7 |
Zusatzinfo | 167 p. |
Verlagsort | New York, NY |
Sprache | englisch |
Maße | 195 x 260 mm |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
ISBN-10 | 1-4613-7798-6 / 1461377986 |
ISBN-13 | 978-1-4613-7798-6 / 9781461377986 |
Zustand | Neuware |
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