Copper Wire Bonding
Springer-Verlag New York Inc.
978-1-4614-5760-2 (ISBN)
In summary, this book:
Introduces copper wire bonding technologies
Presents copper wire bonding processes
Discusses copper wire bonding metallurgies
Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes
Covers the reliability tests and concerns
Covers the current implementation of copper wire bonding in the electronicsindustry
Features 120 figures and tables
Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Preeti Chauhan is a researcher from the Center for Advanced Life Cycle Engineering at the University of Maryland. She is currently a technology development Q&R engineer at Intel Corporation. Anupam Choubey is a consultant in the area of packaging engineering in the Boston, MA area. ZhaoWei Zhong is a Professor of Mechanical and Aerospace Engineering at Nanyang Technological University. Michael Pecht is a world renowned reliability engineer and educator. He is the founder and Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland.
Copper Wire Bonding.- Bonding Process.- Bonding Metallurgies.- Wire Bond Evaluation.- Thermal Reliability Tests.- Humidity and Electromigration Tests.- Wire Bond Pads.- Concerns and Solutions.- Recommendations.- Appendix A: Reliability Data.- Appendix B: Patents on Copper Wire Bonding.
Zusatzinfo | 20 Illustrations, color; 84 Illustrations, black and white; XXVI, 235 p. 104 illus., 20 illus. in color. |
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Verlagsort | New York, NY |
Sprache | englisch |
Maße | 155 x 235 mm |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
Technik ► Maschinenbau | |
Schlagworte | Copper Wire Bonding • Pad Finish Thickness • Wire Bonding Metallurgies • Wire Bonding Performance • Wire Bonding Process • Wire Bonding Strength |
ISBN-10 | 1-4614-5760-2 / 1461457602 |
ISBN-13 | 978-1-4614-5760-2 / 9781461457602 |
Zustand | Neuware |
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