23rd ISTFA Conference Proceedings

Proceedings from the 23rd International Symposium on Testing and Failure Analysis, Santa Clara, CA, 27-31 October 1997 Symposium proceedings of the pre-eminent conference of microelectronics failure analysis offers information on new and emerging testing and diagnostic techniques that are keeping failure analysts on pace with the rapid changes in microelectronics devise manufacturing. Description: Nearly 60 pages by authors from around the world discuss the tools and techniques that provide the basis for characterizing microelectronic devices. Information covers the latest advances in failure analysis, fault isolation techniques, and diagnostic and screening tests for decrete components, ICs, and microelectronic systems. Market/Audience: Failure analysts/engineers, quality control managers, and failure lab managers. Contents: Testing and Signature Analysis Techniques I, II, and III MEMs Discretes Packaging FIB/E-Beam Case Histories I and II.