MEMS and Nanotechnology, Volume 4 (eBook)

Integrated Process Feasibility of Hard-mask for Tight Pitch Interconnects Fabrication.- Thermoelectric Effects in Current Induced Crystallization of Silicon Microstructures.- Evaluation of Resistance Measurement Techniques in Carbon Black and Carbon.- Nano-tubes Reinforced Epoxy.- A Nano-tensile Tester for Creep Studies.- The Measurement of Cyclic Creep Behavior in Copper Thin Film Using Microtensile Testing.- New Insight Into Pile-Up in Thin Film Indentation.- Measuring Substrate-independent Young’s Modulus of Thin Films.- Analysis of Spherical Indentation of an Elastic Bilayer Using a Modified Perturbation Approach.- Nano-indentation Studies of Polyglactin 910 Monofilament Sutures.- Analytical Approach for the Determination of Nanomechanical Properties for Metals.- Advances in Thin Film Indentation.- Cyclic Nanoindentation Shakedown of Muscovite and its Elastic Modulus Measurement.- Assessment of Digital Holography for 3D-shape Measurement of Micro Deep Drawing Parts in Comparison to Confocal Microscopy.- Full-field Bulge Testing Using Global Digital Image Correlation.- Experimental Investigation of Deformation Mechanisms Present in Ultrafine-grained Metals.- Characterization of  a Variation on AFIT's Tunable MEMS Cantilever Array Metamaterial.- MEMS for Real-time Infrared Imaging.- New Insights Into Enhancing Microcantilever MEMS Sensors.- A Miniature MRI-compatible Fiber-optic Force Sensor Utilizing Fabry-Perot Interferometer.- Micromechanical Structure With Stable Linear Positive and Negative Stiffness.- Terahertz Metamaterial Structures Fabricated by PolyMUMPs.- Investigations Into 1D and 2D Metamaterials at Infrared Wavelengths.- MEMS Integrated Metamaterials With Variable Resonance Operating at RF Frequencies.- Creep Measurements in Free-standing Thin Metal Film Micro-cantilever Bending.- MEMS Reliability for Space Applications by Elimination of Potential Failure Modes Through Analysis.- Analysis and Evaluation Methods Associated With the Application of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies.- Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-based Luminaire.- Direct Determination of Interfacial Traction-separation Relations in Chip-package Systems