Ceramic Thick Films for MEMS and Microdevices
Seiten
2011
William Andrew Publishing (Verlag)
978-1-4377-7817-5 (ISBN)
William Andrew Publishing (Verlag)
978-1-4377-7817-5 (ISBN)
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The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. This book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used.
The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications – forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads. Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc.
The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications – forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads. Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc.
Dr. Robert Dorey is a Royal Academy of Engineering/EPSRC Research Fellow, Senior Lecturer in Micro a
Integration and applications
Routes to thick films
Thick film deposition techniques
Microstructure-property relationships
Pattering and structuring
Houston, we have a problem: Thick film troubleshooting
Recipes and techniques
Reihe/Serie | Micro & Nano Technologies |
---|---|
Verlagsort | Norwich |
Sprache | englisch |
Maße | 191 x 235 mm |
Gewicht | 540 g |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
ISBN-10 | 1-4377-7817-8 / 1437778178 |
ISBN-13 | 978-1-4377-7817-5 / 9781437778175 |
Zustand | Neuware |
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Buch | Hardcover (2023)
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49,99 €