Silicon Devices and Process Integration - Badih El-Kareh

Silicon Devices and Process Integration

Deep Submicron and Nano-Scale Technologies

(Autor)

Buch | Softcover
598 Seiten
2010 | Softcover reprint of hardcover 1st ed. 2009
Springer-Verlag New York Inc.
978-1-4419-4224-1 (ISBN)
117,69 inkl. MwSt
Compiled from industrial and academic lecture notes and reflecting years of experience in the development of silicon devices, this book covers both their theoretical and practical aspects, and how their electrical properties and processing conditions interact.
Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author’s industrial and academic lecture notes and reflects years of experience in the development of silicon devices.


Features include:








A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;







State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;







CMOS-only applications, such as subthreshold current and parasitic latch-up;







Advanced Enabling processes and process integration.





This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.

Properties of the Silicon Crystal. Valence-bond and energy-band models. Thermal equilibrium statistics. Carrier transport mechanisms. Non-equilibrium conditions and carrier lifetime.- Junctions and Contacts. Ohmic, non-ohmic, and rectifying contacts. PN junctions, homo- and hetero-junctions. Contact und junction characterization, parameter extraction. Varactors.- Junction Field-Effect Transistor, JFET. Structure and mode of operation. Physics of JFET. JFET characterization and parameter extraction. High-voltage applications. Parasitic effects.- Bipolar Junction Transistor, BJT. Structure and mode of operation. Physics of BJT. Heterojunction Bipolar Transistor, HBT. Transistor characterization and parameter extraction. High-voltage applications.- Parasitic effects.

Erscheint lt. Verlag 29.10.2010
Zusatzinfo XXVI, 598 p.
Verlagsort New York, NY
Sprache englisch
Maße 155 x 235 mm
Themenwelt Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
ISBN-10 1-4419-4224-6 / 1441942246
ISBN-13 978-1-4419-4224-1 / 9781441942241
Zustand Neuware
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