3D IC Stacking Technology

Banqiu Wu is Chief Technology Officer, TSV and Mask Products Business Group, Applied Materials, Inc. Dr. Wu has published over 50 technological papers in 10 peer-reviewed journals and conference proceedings, and authored/co-authored several books, including Photomask Fabrication Technology and Extreme Ultraviolet Lithography. He holds multiple patents and awards. Dr. Ajay Kumar is Vice President and General Manager of TSV and Mask Products Business Group, Applied Materials, Inc. He has more than 75 publications to his credit in various journals including several review articles. Dr. Kumar co-authored the book Extreme Ultraviolet Lithography. He holds more than 100 US patents and has won many awards for innovation and commercialization. Sesh Ramaswami is a senior director of TSV strategy and marketing at Applied Materials, Inc. His responsibilities include TSV and associated wafer level processing for packaging. Ramaswami holds 35 US patents and has 40+ conference publications and presentations in conferences such as MRS, ECS, VMIC, AVS, SPIE and IRPS.

Chapter 1. Introduction to High-Density Through Silicon Stacking Technology
Chapter 2. A Practical Design Eco-System for Heterogeneous 3D IC Products
Chapter 3. Design Automation and TCAD Tool Solutions for Through Silicon Via-Based 3D IC Stack
Chapter 4. Process Integration for TSV Manufacturing
Chapter 5. High-Aspect-Ratio Silicon Etch for TSV
Chapter 6. Dielectric Deposition for Through Silicon Vias
Chapter 7. Barrier and Seed Deposition
Chapter 8. Copper Electrodeposition for TSV
Chapter 9. Chemical Mechanical Polishing for TSV
Chapter 10. Temporary and Permanent Bonding
Chapter 11. Assembly and Test Aspects of TSV Technology
Index