Electronics Reliability and Measurement Technology

Nondestructive Evaluation

Joseph S. Heyman (Autor)

Buch | Hardcover

140 Seiten

1998
William Andrew Publishing (Verlag)
978-0-8155-1171-7 (ISBN)

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This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.

Measurement Science and Manufacturing Science ResearchNondestructive SEM for Surface and Subsurface Wafer ImagingSurface Inspection-Research and DevelopmentWafer Level Reliability for High-Performance VLSI DesignWafer Level Reliability Testing: an Idea Whose Time Has ComeMicro-Focus X-Ray ImagingMeasurement of Opaque Film ThicknessIntelligent Laser Soldering Inspection and Process ControlRupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density CircuitsHeterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement""Whole Wafer"" Scanning Electron Microscopy

Erscheint lt. Verlag	31.12.1998
Verlagsort	Norwich
Sprache	englisch
Maße	152 x 229 mm
Gewicht	490 g
Themenwelt	Technik ► Elektrotechnik / Energietechnik
ISBN-10	0-8155-1171-X / 081551171X
ISBN-13	978-0-8155-1171-7 / 9780815511717
Zustand	Neuware