Multichip Module Technology Handbook

Philip Garrou, Iwona Turlik, IMAPS (ISHM) (Autoren)

Buch | Hardcover

688 Seiten

1997
McGraw-Hill Professional (Verlag)
978-0-07-022894-8 (ISBN)

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Multichip Modules (MCMs) house multiple integrated circuits upon a single chip and their use in design allows systems that are faster and more reliable. A reference for the designer with everything needed to understand and work with MCMs.

MCMs are electronic components that house multiple integrated circuits (ICs) upon a single chip. Their use in design allow systems that are faster, hotter and more reliable than those built with standalone ICs. More and more, the speed needs of electronic systems require MCMs. This comprehensive handbook aims to provide designers with the knowledge needed to understand and work with MCMs.

McGraw-Hill authors represent the leading experts in their fields and are dedicated to improving the lives, careers, and interests of readers worldwide

Tech Drivers.MCM - Ceramic.MCM - Deposited.MCM - Laminate.Large Area Processing.MCM Assembly.MCM Package Design.3D Packaging.Module to Board Interconnect.MCM Desing.MCM Electrical Performance.High Clock Rate Systems.Thermal Issues.Known Good Die (KGD).MCM Test & Inspect.

Erscheint lt. Verlag	16.11.1997
Zusatzinfo	600 Illustrations, unspecified
Sprache	englisch
Maße	196 x 236 mm
Gewicht	1542 g
Themenwelt	Schulbuch / Wörterbuch ► Lexikon / Chroniken
	Technik ► Elektrotechnik / Energietechnik
	Technik ► Nachrichtentechnik
ISBN-10	0-07-022894-9 / 0070228949
ISBN-13	978-0-07-022894-8 / 9780070228948
Zustand	Neuware