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Handbook Thick Film Hybrid Microelectronics: A Practical Sourcebook for Designers, Fabricators and Users
McGraw-Hill Professional
978-0-07-026680-3 (ISBN)
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Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.
Circuit Design, Component Selection, and Layout Generation.Photofabrication Operations, Screens, and Masks.Facilities, Equipment, and Manufacturing Operations for Circuit Deposition and Testing.Substrates for Thick Film Circuits.Conductor Materials, Processing, and Controls.Resistor Materials, Processing and Controls.Dielectric Materials, Processing and Controls.Assembly Techniques and Equipment.Packaging and Interconnection of Assembled Circuits.
Erscheint lt. Verlag | 1.9.1974 |
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Sprache | englisch |
Gewicht | 970 g |
Themenwelt | Schulbuch / Wörterbuch ► Lexikon / Chroniken |
Technik ► Elektrotechnik / Energietechnik | |
ISBN-10 | 0-07-026680-8 / 0070266808 |
ISBN-13 | 978-0-07-026680-3 / 9780070266803 |
Zustand | Neuware |
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