Failure Mechanisms in Semiconductor Devices - E. Ajith Amerasekera, Farid N. Najm

Failure Mechanisms in Semiconductor Devices

Buch | Hardcover
360 Seiten
1997 | 2nd edition
John Wiley & Sons Inc (Verlag)
978-0-471-95482-8 (ISBN)
252,47 inkl. MwSt
In this second edition, the authors identify the sources of failure mechanism in semiconductor devices, examine possible detection and elimination techniques, and determine the effectiveness of reliability devices. The references have been updated and recent advances are discussed.
Failure Mechanisms in Semiconductor Devices Second Edition E. Ajith Amerasekera Texas Instruments Inc., Dallas, USA Farid N. Najm University of Illinois at Urbana-Champaign, USA Since the successful first edition of Failure Mechanisms in Semiconductor Devices, semiconductor technology has become increasingly important. The high complexity of today's integrated circuits has engendered a demand for greater component reliability. Reflecting the need for guaranteed performance in consumer applications, this thoroughly updated edition includes more detailed material on reliability modelling and prediction. The book analyses the main failure mechanisms in terms of cause, effects and prevention and explains the mathematics behind reliability analysis. The authors detail methodologies for the identification of failures and describe the approaches for building reliability into semiconductor devices. Their thorough yet accessible text covers the physics of failure mechanisms from the semiconductor die itself to the packaging and interconnections. Incorporating recent advances, this comprehensive survey of semiconductor reliability will be an asset to both engineers and graduate students in the field.

E. Ajith Amerasekera is the author of Failure Mechanisms in Semiconductor Devices, 2nd Edition, published by Wiley. Farid N. Najm is the author of Failure Mechanisms in Semiconductor Devices, 2nd Edition, published by Wiley.

Reliability Mathematics.

Principal Failure Mechanisms.

Failure Mechanisms in Technologies and Circuits.

Reliability Testing.

Reliability Prediction.

Screening.

Failure Analysis.

Quality Assurance.

Appendix.

Indexes.

Erscheint lt. Verlag 20.6.1997
Verlagsort New York
Sprache englisch
Maße 156 x 233 mm
Gewicht 680 g
Themenwelt Naturwissenschaften Physik / Astronomie Festkörperphysik
Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
ISBN-10 0-471-95482-9 / 0471954829
ISBN-13 978-0-471-95482-8 / 9780471954828
Zustand Neuware
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