Co-simulations of Microwave Circuits and High-Frequency Electromagnetic Fields
Springer Verlag, Singapore
978-981-99-8306-3 (ISBN)
The book is divided into three parts. The first part introduces the two latest versions of ADS and HFSS and helps readers better understand the basic principles and latest functions better. It also advises how to choose appropriate simulation tools for different problems. The second part mainly describes co-simulations for high-frequency EM fields, microwave circuits, antenna designs, EM compatibility (EMC), and thermal and structural analyses. It provides guides and advices on performing co-simulations by ADS and HFSS incorporated with other types of software, respectively. The last part narrates the automation interfaces and script programming methods for co-simulations. It primarily deals with the Advanced Extension Language (AEL), Python Data Link (PDL), and MATLAB interface in ADS. For HFSS, it discusses VBScript, IronPython scripting, and Application Programming Interface (APIs) based on MATLAB. Each topic contains practical examples to help readers understand so that they can gain a solid knowledge and skills regarding automated interfaces and scripting methods based on these kinds of software.
Concisely written in combination with practical examples, this book is very suitable as a textbook in introductory courses on microwave circuit and EM simulations and also as a supplementary textbook in many courses on electronics, microwave engineering, communication engineering, and related fields. As well, it can serve as a reference book for microwave engineers and researchers.
Mei Song Tong is a distinguished/permanent professor, the head of the Department of Electronic Science and Technology, and vice dean of the College of Microelectronics at Tongji University, Shanghai, China. He has also held an adjunct professorship at the University of Illinois at Urbana-Champaign, Urbana, Illinois, USA, and an honorary professorship at the University of Hong Kong, China. He received his B.S. and M.S. degrees in electrical engineering from Huazhong University of Science and Technology, Wuhan, China, and his Ph.D. degree in electrical engineering from Arizona State University, Tempe, Arizona, USA. He has published more than 600 papers in refereed journals and conference proceedings and co-authored six books or book chapters. His research interests include electromagnetic field theory, antenna theory and design, simulation and design of RF/microwave circuits and devices, interconnect and packaging analysis, inverse electromagnetic scattering for imaging, and computational electromagnetics. Xiaoyu Li received his B.S. degree in communication and information engineering and his M.S. degree in electronic and information engineering from the University of Electronic Science and Technology of China, Chengdu, China, in 2017 and 2020, respectively. He is currently pursuing a Ph.D. degree in control science and engineering with Tongji University, Shanghai, China. His current research interests include development of RF/microwave circuits and devices, antenna theory and design, and computational electromagnetics.
Introduction to Co-simulations of Microwave Circuits and High-Frequency Electromagnetic Fields.- Co-simulations of High Frequency Electromagnetic Fields (HFEMFs).- Co-simulations of Microwave Circuits.- Co-simulations of Antenna.- Co-simulations of Electromagnetic Compatibility.- Co-simulations of Thermal.- Co-simulations of Structural.- Automation Interfaces and Script Programming Methods for Co-simulations.
Erscheinungsdatum | 04.07.2024 |
---|---|
Zusatzinfo | 166 Illustrations, color; 7 Illustrations, black and white; XX, 445 p. 173 illus., 166 illus. in color. |
Verlagsort | Singapore |
Sprache | englisch |
Maße | 155 x 235 mm |
Themenwelt | Naturwissenschaften ► Physik / Astronomie ► Elektrodynamik |
Naturwissenschaften ► Physik / Astronomie ► Optik | |
Technik ► Elektrotechnik / Energietechnik | |
Schlagworte | Advanced Design System • High Frequency Electromagnetic Simulation • High Frequency Structure Simulator • Microwave Circuit Simulation • Multidisciplinary Co-Simulation |
ISBN-10 | 981-99-8306-1 / 9819983061 |
ISBN-13 | 978-981-99-8306-3 / 9789819983063 |
Zustand | Neuware |
Haben Sie eine Frage zum Produkt? |
aus dem Bereich