High Temperature Component Life Assessment
Seiten
1994
Chapman and Hall (Verlag)
978-0-412-58520-3 (ISBN)
Chapman and Hall (Verlag)
978-0-412-58520-3 (ISBN)
The aim of this book is to investigate and explain the rapid advances in the characterization of high temperature crack growth behaviour which have been made in recent years, with reference to industrial applications. Complicated mathematics has been minimized with the emphasis placed instead on finding solutions using simplified procedures without the need for complex numerical analysis.
1 Introduction.- 2 Processes of deformation and fracture at high temperatures.- 3 Stress analysis of uncracked bodies.- 4 Stress analysis of cracked bodies.- 5 Models for creep crack initiation and growth.- 6 Creep—fatigue crack growth.- 7 Experimental determinations of high temperature crack growth.- 8 Practical applications.
| Erscheint lt. Verlag | 31.3.1994 |
|---|---|
| Zusatzinfo | XII, 328 p. |
| Verlagsort | London |
| Sprache | englisch |
| Maße | 156 x 234 mm |
| Themenwelt | Naturwissenschaften ► Physik / Astronomie ► Mechanik |
| Technik ► Maschinenbau | |
| ISBN-10 | 0-412-58520-0 / 0412585200 |
| ISBN-13 | 978-0-412-58520-3 / 9780412585203 |
| Zustand | Neuware |
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