Land Subsidence Induced by the Engineering-Environmental Effect
Springer Verlag, Singapore
978-981-13-5693-3 (ISBN)
Professor Zhendong Cui received his Ph.D. Degree from the School of Civil Engineering, Tongji University in 2008. He worked as a postdoctoral research fellow for one year at the Hong Kong University of Science and Technology. He currently works as a professor in the School of Mechanics and Civil Engineering at the China University of Mining and Technology (CUMT). He is also a visiting scholar at the University of Colorado Boulder from 2015 to 2016. He has published 34 SCI indexed papers in many international journals.
Introduction.- Theoretical Analysis of Land Subsidence Caused by Engineering-Environmental Effect.- In-Site Monitoring Land Subsidence.- Centrifuge Modeling of Land Subsidence Caused by High-Rise Building Group.- Microstructures of Different Soil Layers Before and After Centrifuge Modeling of Land Subsidence Caused by High-Rise Building Group.- Microstructures of the Soil Layer at Different Depths in the Centrifuge Modeling of Land Subsidence Caused by the Interaction of Two High-Rise Buildings.- Physical Model Test of Layered Soil Subsidence Considering Dual Effects of Building Load and Groundwater Withdrawal.- Floor Area Ratio ANFIS Model Affected by Causes of Land Subsidence.- Conclusions and Prospects.
Erscheinungsdatum | 04.03.2022 |
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Zusatzinfo | 129 Illustrations, color; 35 Illustrations, black and white; XXII, 234 p. 164 illus., 129 illus. in color. |
Verlagsort | Singapore |
Sprache | englisch |
Maße | 155 x 235 mm |
Themenwelt | Naturwissenschaften ► Geowissenschaften ► Geografie / Kartografie |
Naturwissenschaften ► Geowissenschaften ► Geologie | |
Naturwissenschaften ► Geowissenschaften ► Meteorologie / Klimatologie | |
Technik ► Bauwesen | |
Schlagworte | ANFIS • Centrifuge Modeling • Dewatering of Groundwater • Floor Area Ratio • High-rise Building Group • In-site Monitoring • Land Subsidence • MIP Test • numerical simulation • SEM Test |
ISBN-10 | 981-13-5693-9 / 9811356939 |
ISBN-13 | 978-981-13-5693-3 / 9789811356933 |
Zustand | Neuware |
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