Instruments, Measurement Principles and Communication Technologies for Downhole Drilling Environments (eBook)

Chinthaka P. Gooneratne is the Sensors & Instrumentation (S&I) Lead and the Technical Leader for the Internet of Things in the Drilling Technology Team at EXPEC Advanced Research Center, Saudi Aramco. He has over 10 years of experience in creating, leading and managing programs designed to commercialize innovative S&I systems and developing emerging markets that utilize advanced S&I. He holds a PhD in Electrical Engineering from Kanazawa University, Japan, is a Senior Member of the Institute of Electrical and Electronics Engineers (IEEE) and has 10 patents/patent applications and published 34 peer-reviewed journal papers, 40 conference papers and 5 book chapters.   Bodong Li joined Saudi Aramco EXPEC Advance Research Center in 2015 as a research engineer working on the development of downhole technologies for drilling and robotic technologies for oil and gas applications.   Max Deffenbaugh is the Sensors Technology Leader at the Aramco Research Center in Houston, TX.  He oversees a team of scientists and engineers who turn concepts for new oilfield instruments into field-proven prototypes.  Max has more than 20 years of research experience in the oil and gas industry.  He holds a Ph.D. in Electrical Engineering and Computer Science from the Massachusetts Institute of Technology and has authored more than 90 publications.   Eric Moellendick serves as Chief Technologist for the Drilling Technology Division of Saudi Aramco’s EXPEC Advanced Research Center. With more than twenty five years of oil and gas industry experience, Eric leads a team of world class researchers in developing the next generation of drilling technology required by Saudi Aramco’s Drilling and Workover stakeholders.

Drilling Hydrocarbon Wells.- Instruments for Formation Evaluation.- Instruments for Well Navigation and Drilling Optimization Evaluation.- Logging Tools in Hydrocarbon Wells.- Downhole Communication and Power Supplies to Instruments and Communication Modules.- Fabrication and Packaging of Downhole Instruments.- New Technologies.- Future Outlook and Perspectives.