Directions for the Next Generation of MMIC Devices and Systems
Springer-Verlag New York Inc.
978-1-4899-1482-8 (ISBN)
Microwave and millimeter-wave integrated circuits (MMICs) are of increasing im- portance in modern military and commercial wireless communication systems. Current trends are towards low-cost, high-density, multilevel,and multifunctional integration, cover- ingmillimeterand submillimeterwave regions.The integrationofdiverse subfunctions, such as light-wave devices, superconductor circuits, digital circuits and ferrite devices, together with conventional microwave or millimeter-wave devices, circuits and antennas, will allow implementation of large systems on a single chip. Research on advanced device concepts, 3-D interconnects, high-performance packaging methods, advanced CAD-tools, measure- ment and testing techniques, as weil as material and fabrication technologies, are being di- rected to meet these new challenges. Continuing on the series ofsymposia sponsored by the Weber Research Institute of Polytechnic University, an international symposium focusing on the current developments and new research initiatives for the next generation ofmicrowave and millimeter wave inte- grated circuits and systems was held at Brooklyn, New York,during September 11-13, 1996.
The symposium was organizedas a3-dayevent,running mostly ina single-session format of regular papers and panel discussions, It was co-sponsored by the Army Research Office, Re- search Triangle Park, NC, in cooperation with the IEEE Microwave Theory and Techniques Society, the IEEE Antennas and Propagation Society, and IEEE Long Island and New York MetropolitanSections.The papers published in this volume are extended versionsofselected papers presented at this symposium.
Scanning the Conference.- Historical Perspectives on Microwave and Millimeter-Wave Integrated Circuits.- Mafet Thrust 3: A Revolutionary Program for Solid-State Microwave and Millimeter-Wave Power.- Future Directions in MMIC Research and Technology: The Wireless Pull.- Systems and Integration.- High Density Microwave Packaging Technology Development for Department of Defense Applications.- Flip Chip Power MMICS Packaging Technology.- Multilevel Vertical Interconnection Technology.- Multilevel Packaging for Low Cost Microwave Functions.- Future Applications of Millimeter Technology.- Distributed Power Combining and Signal Processing in a 2D Quasi-Optical System.- Multilayer Integration of Microwave and Millimeter-Wave Circuits: New Interconnect Methods and Design Considerations.- The Hybrid Integration Technique of Planar and NRD-Guide Circuits for Millimeter-Wave Applications.- Solder Free Interconnects for High Density Phased Array Integration.- Silicon Based On-Wafer and Discrete Packaging.- Patch-MMIC-Ferrite Integration in Novel Phased Array Technology.- Novel Antennas and Device Technology.- Broadbanding Guide Lines of Strip-Element Microstrip Phased Arrays.- U-Slot Patch Wideband Microstrip Antenna.- Surface Wave Mode Reduction for Rectangular Microstrip Antennas on High-Index Materials.- Integrated Strip Gratings on Top of Microstrip Antennas and Arrays for Low and Ultra-Low Cross-Polar Radiation.- A New Type of Dual Band Microstrip Array Fed by a Purely TEM Feeding Network.- The Integrated Dielectric Slab Waveguide-Wedge Antenna.- Dual-Polarized Rectangular Dielectric Resonator Antenna.- SiGe MMIC’s — on the Current State-of-the-Art.- FM Noise and Synchronization Behavior of a SIMMWIC 76.5 GHz Front-End.- Experimental and Numerical Results on High-FrequencyNoise of Si/SiGe HBTs.- The Development of Si and SiGe Technologies for Microwave and Millimeter-Wave Integrated Circuits.- 94 Ghz Schottky Detector with CMOS Preamplifier.- Semiconductor Waveguide Components for Analog Fiber-Optic Links.- Microwave Photonic Links with Very Low (? 3 dB) Amplifierless Noise Figure.- Polymer Optical Waveguides for Multi-Chip Modules.- Low-Voltage MMIC HBT VCO for Millimeter-Wave Communication Systems.- A Triple-Gate MESFET Voltage Variable Attenuator for Miilimeter-Wave Applications.- Modeling and CAD.- Types of Leaky Dominant Modes and Spectral Gaps on Printed-Circuit Lines.- 2-D Integral Spectral Domain Analysis of Leaky Modes in Covered and Uncovered Microstrip Lines.- Excitation of Leaky Modes on Printed Circuit Structures by Practical Feeds: An Investigation of Physical Meaning.- Complex Characteristic Impedance of a Leaky Conductor-Backed Slotline: Alternate Analysis Methods.- Suppression of Leakage on Printed Transmission Lines Using Finite-Width Dielectric Loading.- Electromagnetic Simulation of High-Speed and RF Multi-Chip Modules — An Overview.- Microstrip Antenna Analysis Using a Suite of Modeling Techniques-A Review.- A New Approach to the Design of Microwave Amplifiers.- Broadband Characterization of Representative Circuit-To-Circuit Interconnections.- Speculations on the Next Ten Years in Electromagnetic Field Simulation.- Ann and Knowledge-Based Approaches for Microwave Design.- CAD Needs for Flip Chip Coplanar Waveguide Monolithic Microwave Integrated Circuit Technology.- Computer Aided Design Tools for Microstrip Circuitries — An Application to Microstrip Patch Antennas of Circular Geometry.- Matching and Compensation Network Synthesis for MMICs.
| Zusatzinfo | XI, 415 p. |
|---|---|
| Verlagsort | New York |
| Sprache | englisch |
| Maße | 178 x 254 mm |
| Themenwelt | Naturwissenschaften ► Physik / Astronomie ► Elektrodynamik |
| Technik ► Elektrotechnik / Energietechnik | |
| ISBN-10 | 1-4899-1482-X / 148991482X |
| ISBN-13 | 978-1-4899-1482-8 / 9781489914828 |
| Zustand | Neuware |
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