Numerical Assessments of Cracks in Elastic-Plastic Materials
Springer Berlin (Verlag)
978-3-642-53663-2 (ISBN)
1. Introduction.- 2. Cracks under stationary conditions.- 2.1 Higher-order solutions for pressure-sensitive materials.- 2.2 Two-parameter characterizations for engineering materials.- 2.3 Effects of biaxial loads to plane stress cracks.- 2.4 Three-dimensional crack front fields.- 2.5 Remarks.- 3. Cracks under thermal-mechanical loading conditions.- 3.1 Characterization of cracks under high temperature gradients.- 3.2 Scaling of temperature-induced material inhomogeity.- 3.3 Effects of transient thermal loading.- 3.4 Remarks.- 4. Interface cracks.- 4.1 Stationary interface crack tip fields.- 4.2 Quasi-static crack growth.- 4.3 Dynamic interface crack growth.- 4.4 Remarks.- 5. Mixed mode crack propagation.- 5.1 Static crack growth under combined mode I and III conditions.- 5.2 Dynamic crack growth under combined mode I and III conditions.- 5.3 Remarks.- 6. Assessment of apex-V notches.- 6.1 Higher-order solutions for power-law hardening materials.- 6.2 Notches in pressure-sensitive materials.- 6.3 Remarks.- References.
Erscheint lt. Verlag | 20.7.2012 |
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Reihe/Serie | Lecture Notes in Applied and Computational Mechanics |
Zusatzinfo | VIII, 311 p. |
Verlagsort | Berlin |
Sprache | englisch |
Maße | 155 x 235 mm |
Gewicht | 492 g |
Themenwelt | Informatik ► Theorie / Studium ► Künstliche Intelligenz / Robotik |
Mathematik / Informatik ► Mathematik ► Wahrscheinlichkeit / Kombinatorik | |
Naturwissenschaften ► Physik / Astronomie ► Mechanik | |
Technik ► Maschinenbau | |
Schlagworte | asymptotic methods • Fracture • fracture mechanics • linear optimization • Mechanics • Stress |
ISBN-10 | 3-642-53663-8 / 3642536638 |
ISBN-13 | 978-3-642-53663-2 / 9783642536632 |
Zustand | Neuware |
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