Manufacturing Challenges in Electronic Packaging

1. Manufacturing challenges in electronic packaging: an overview.- 1.1 Introduction.- 1.2 Industries and markets and applications segments.- 1.3 Semiconductor technology trends and roadmap forecast.- 1.4 Microelectronic packaging.- 1.5 PCB manufacturing for organic packaging.- 1.6 Assembly technology in manufacturing of electronic packages.- 1.7 Conclusion.- References.- 2. Challenges in solder assembly technologies.- 2.1 Introduction.- 2.2 The interaction of soldering process with soldering materials.- 2.3 Processing the challenges.- 2.4 Soldering materials issues.- 2.5 Summary and conclusions.- References.- 3. Testing and characterization.- 3.1 Introduction.- 3.2 Coefficient of thermal expansion.- 3.3 Mechanical characterization of thin-film materials.- 3.4 Tensile ductility of plated copper.- 3.5 PTH cracking.- 3.6 Warpage.- 3.7 Solder strain.- 3.8 Fracture toughness and crack propagation.- 3.9 Adhesion and interfacial delamination.- 3.10 Moisture.- 3.11 Summary.- References.- 4. Design for manufacture and assembly of electronic packages.- 4.1 Introduction.- 4.2 General considerations.- 4.3 Design guidelines for the manufacture of PCBs.- 4.4 Design guidelines for the assembly of PCBs.- 4.5 Estimating the assembly cost.- 4.6 Case study.- 4.7 Concluding remarks.- References.- 5. Process modeling, optimization and control in electronics manufacturing.- 5.1 Introduction.- 5.2 Physical models.- 5.3 Empirical models.- 5.4 Combined physical-empirical models.- 5.5 Process optimization.- 5.6 Run-by-run and real-time process control.- 5.7 Concluding remarks.- References.- 6. Integrated manufacturing system for printed circuit board assembly.- 6.1 Introduction.- 6.2 Requirements of PCB assembly system.- 6.3 Outline of integrated manufacturing system for PCB assembly.- 6.4 Assembly process planning.- 6.5 Assembly scheduling.- References.