Global Life Cycle Impact Assessments of Material Shifts (eBook)

Dr A.S.G. Andrae currently works for Huawei Technologies Sweden AB in the capacity of senior expert life cycle assessment. He has been a post-doctoral researcher at the National Institute of Advanced Industrial Science & Technology in Tsukuba in Japan. He obtained a PhD and a Lic. Eng. in electronics production from Chalmers University of Technology in Sweden in 2005 and 2002 respectively, following his receipt of an MSc in chemical engineering from the Royal Institute of Technology in Stockholm, Sweden in 1997. Andrae has published several journal papers on the life cycle assessment (LCA) of solders and conductive adhesives, as well as on LCA in microelectronics.

Preface 5
Acknowledgments 8
Contents 9
Abbreviations 13
List of Figures 15
List of Tables 18
1 Introduction 20
1.1 Background 20
1.2 Goal and Scope 26
1.3 Outline of the Book 26
References 27
2 Interconnection Materials – Technical Research Status 30
2.1 Solders 30
2.2 Conductive Adhesives 35
2.3 Solder-free Alternatives 37
2.4 Plating Materials and Metal Spheres for Ball Grid Arrays 38
2.5 Perspectives 39
References 39
3 Environmental Life Cycle Assessment from a LIME Perspective 42
3.1 Definition of LCA and LCI 43
3.2 Application of LCA 48
3.3 Environmental Cost 48
3.4 The Japanese LIME System for Life Cycle Impact Assessment 50
3.5 Previous Research on LCA of Interconnection Materials 65
References 75
4 Methodology 78
4.1 Software 78
4.2 Databases 91
4.3 Methodology for Consequential Process-sum LCIA Using LIME and Uncertainty Analysis 91
4.4 Consequential LCI 94
4.5 Input–Output Tables Expanded with Environmental Loadings 112
4.6 Eco-efficiency 113
4.7 Data Analysis in LCI – Dominance, Uncertainty, and Sensitivity 114
References 116
5 LCA Case Studies of Solders 118
5.1 Pb Solder Compared to Pb-free Solder 118
5.2 LIME Evaluation of the Shift to Pb-free 138
5.3 Toxicity Evaluations 141
5.4 Future Solders Assessed 145
References 154
6 LCAs of Pb Solders vs. Conductive Adhesives 155
6.1 Comparative LIME Analysis of Plating Materials 155
6.2 LCA for High-temperature Materials Using Alternate LCI Data 159
6.3 Hidden Material Flows 160
6.4 Estimation of the LIME-based Environmental Cost of Future Conductive Adhesives 166
References 176
7 Discussion 178
7.1 Solders 179
7.2 Platings 184
7.3 Conductive Adhesives 184
7.4 Are Pb-free Interconnection Materials “Ecomaterials”? 185
References 188
8 Conclusions 190
9 Looking Ahead 192
Reference 194
Index 195