Rheinisch-Westfälische Akademie der Wissenschaften - Bernd Höfflinger

Rheinisch-Westfälische Akademie der Wissenschaften

Natur-, Ingenieur- und Wirtschaftswissenschaften Vorträge · N 386
Buch | Softcover
55 Seiten
1991 | 1991
VS Verlag für Sozialwissenschaften
978-3-531-08386-5 (ISBN)
54,99 inkl. MwSt

Bernd Höfflinger has a lifelong career with semiconductor chips. After starting at Siemens Research, he was invited to join the faculty at Cornell University, where he set up and taught the first graduate course on integrated circuits (IC s). He continued as the first product manager for MOS IC s, Siemens, Munich. With that experience, he became a co-founder of the University of Dortmund, where he built the first public pilot line for IC s in Europe, which realized the world s first all-ion-implanted Bipolar-CMOS process. As Head of the Electrical Engineering Departments at the University of Minnesota and at Purdue University, he led the major expansions of their electronics programs. He was invited back to Germany to build and lead the Institute for Microelectronics Stuttgart. As a public enterprise for contract R&D, it became one of the first certified manufacturing lines in Europe for CMOS Application-Specific Circuits. It has become the world leader in the development and manufacture of test masks for every next-generation lithography since the 1990's. Bernd Höfflinger has been the recipient or co-recipient of numerous scientific and best-product awards. He is a member of the Dusseldorf Academy of Sciences

Neuere Entwicklungen der Silizium-Mikroelektronik.- 1. Zusammenfassung.- 2. Mikron-Elektronik.- 3. Die Rolle der Siliziumstechnologie.- 4. Silizium-Chips.- 5. Silizium-Systeme.- Literatur.- Diskussionsbeiträge Professor Dr. rer. nat. Bernhard Körte; Professor Dr. rer. nat. Bernd Höfflinger; Professor Dr.-Ing. Rolf Staufenbiel; Professor Dr. rer. nat. Werner Schreyer; Dr. rer. nat. Magdala Gronau; Professor Dr. rer. nat. Eckart Kneller.

Erscheint lt. Verlag 1.1.1991
Zusatzinfo 55 S.
Verlagsort Wiesbaden
Sprache deutsch
Maße 170 x 244 mm
Gewicht 128 g
Themenwelt Naturwissenschaften Physik / Astronomie
Technik Elektrotechnik / Energietechnik
Schlagworte Forschung • Mikroelektronik • Systeme • Technologie
ISBN-10 3-531-08386-4 / 3531083864
ISBN-13 978-3-531-08386-5 / 9783531083865
Zustand Neuware
Haben Sie eine Frage zum Produkt?
Mehr entdecken
aus dem Bereich
von den Werkzeugen über Methoden zum TQM

von Holger Brüggemann; Peik Bremer; Stefan Zischka

Buch | Softcover (2024)
Springer Fachmedien (Verlag)
32,99
Problem Solving with Python

von Rubin H. Landau; Manuel J. Páez …

Buch | Softcover (2024)
Wiley-VCH (Verlag)
109,00