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Advances in Research and Development

Modeling of Film Deposition for Microelectronic Applications
Buch | Hardcover
290 Seiten
1997
Academic Press Inc (Verlag)
978-0-12-533022-0 (ISBN)
169,95 inkl. MwSt
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This serial contains studies of the properties of various thin films materials and systems. This volume presents five different models of computer simulation techniques to thin film deposition as applied to modern microelectronics.
Physics of Thin Films is one of the longest running continuing series in thin film science, consisting of 22 volumes since 1963. The series contains quality studies of the properties of various thin filmsmaterials and systems.
In order to be able to reflect the development of today's science and to cover all modern aspects of thin films, the series, starting with Volume 20, has moved beyond the basic physics of thin films. It now addresses the most important aspects of both inorganic and organic thin films, in both their theoretical as well as technological aspects. Therefore, in order to reflect the modern technology-oriented problems, the title has been slightly modified from Physics of Thin Films to Thin Films.

M.J. Brett, S.K. Dew, and T.J. Smy, Thin Film Microstructure and Process Simulation Using SIMBAD. S. Hamaguchi, Mathematical Methods for Thin Films Deposition Simulations. C.-C. Fang, V. Prasad, R.V. Joshi, F. Jones, and J.J. Hsieh, A Process Model for Sputter-Deposition of Thin Films Using Molecular Dynamics. T.S. Cale and V. Mahadev, Feature Scale Transport and Reaction during Low Pressure. Chapter References. Author Index. Subject Index.

Erscheint lt. Verlag 29.1.1997
Reihe/Serie Thin Films
Mitarbeit Herausgeber (Serie): Ronald Powell, John L. Vossen, Maurice H. Francombe, Abraham Ulman
Verlagsort San Diego
Sprache englisch
Maße 152 x 229 mm
Gewicht 620 g
Themenwelt Informatik Grafik / Design Digitale Bildverarbeitung
Naturwissenschaften Physik / Astronomie Festkörperphysik
Technik Maschinenbau
ISBN-10 0-12-533022-7 / 0125330227
ISBN-13 978-0-12-533022-0 / 9780125330220
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