Production Planning and Control in Semiconductor Manufacturing - Tin-Chih Toly Chen

Production Planning and Control in Semiconductor Manufacturing

Big Data Analytics and Industry 4.0 Applications
Buch | Softcover
VI, 100 Seiten
2022 | 1st ed. 2023
Springer International Publishing (Verlag)
978-3-031-14064-8 (ISBN)
53,49 inkl. MwSt
This book systematically analyzes the applicability of big data analytics and Industry 4.0 from the perspective of semiconductor manufacturing management. In recent years, technologies of big data analytics and Industry 4.0 have been frequently applied to the management of semiconductor manufacturing.

This book systematically analyzes the applicability of big data analytics and Industry 4.0 from the perspective of semiconductor manufacturing management. It reports in real examples and presents case studies as supporting evidence. In recent years, technologies of big data analytics and Industry 4.0 have been frequently applied to the management of semiconductor manufacturing. However, related research results are mostly scattered in various journal issues or conference proceedings, and there is an urgent need for a systematic integration of these results. In addition, many related discussions have placed too much emphasis on the theoretical framework of information systems rather than on the needs of semiconductor manufacturing management. This book addresses these issues.

Dr. Toly Chen has been the editor-in-chief of International Journal of Internet Manufacturing and Services. He also guest edited several special issues on 3D printing, ubiquitous manufacturing, and cloud manufacturing. Dr. Chen has published a few papers on semiconductor manufacturing management in journals such as Journal of Intelligent Manufacturing, Robotics and Computer-Integrated Manufacturing, International Journal of Advanced Manufacturing Technology, IEEE Transactions on Semiconductor Manufacturing.

Chapter 1. Big Data Analytics for Semiconductor Manufacturing.- Chapter 2. Industry 4.0 for Semiconductor Manufacturing.- Chapter 3. Cycle Time Prediction and Output Projection.- Chapter 4. Defect Pattern Analysis, Yield Learning Modeling and Yield Prediction.- Chapter 5. Job Sequencing and Scheduling.

Erscheinungsdatum
Reihe/Serie SpringerBriefs in Applied Sciences and Technology
Zusatzinfo VI, 100 p. 79 illus., 58 illus. in color.
Verlagsort Cham
Sprache englisch
Maße 155 x 235 mm
Gewicht 177 g
Themenwelt Mathematik / Informatik Informatik
Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
Schlagworte Big Data Analytics • Cloud Computing • Cyper Physical System • Deep learning • Industry 4.0 • internet of things • semiconductor manufacturing
ISBN-10 3-031-14064-8 / 3031140648
ISBN-13 978-3-031-14064-8 / 9783031140648
Zustand Neuware
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