Digital Integrated Circuits - John E. Ayers

Digital Integrated Circuits

Analysis and Design

(Autor)

Buch | Hardcover
720 Seiten
2003
Crc Press Inc (Verlag)
978-0-8493-1951-8 (ISBN)
89,75 inkl. MwSt
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There is no field of enterprise more dynamic or challenging than digital integrated circuits. Taking an interdisciplinary approach, this book provides broad coverage of the field relevant to students interested in designing integrated circuits and to those aiming towards designing with integrated circuits and focuses on the underlying principles.
There is no field of enterprise today more dynamic or more challenging than Digital Integrated Circuits. But because of its rapid development, the field has quickly outgrown most of the standard textbooks. The field is also decidedly interdisciplinary. Engineers now must understand materials, physics, devices, processing electromagnetics, computer tools, and economics along with circuits and design rules, but few if any texts take the interdisciplinary approach that best prepares students for their future studies and practice.

Author John Ayers designed Digital Integrated Circuits: Analysis and Design to meet three primary objectives:

Take an interdisciplinary approach that will stay relevant for years to come

Provide broad coverage of the field relevant to students interested in designing integrated circuits and to those aiming towards designing with integrated circuits

Focus on the underlying principles rather than the details of current technologies that will soon be obsolete

Rich with pedagogical features and supplementary materials, this book appears destined to set a new standard for digital integrated circuits texts. It provides all of the materials you need to offer the best possible course for engineering or computer science students, and it's clear, systematic presentation and wealth of solved examples build the solid, practical foundation today's students need.

Prerequisites: Students will need an upper-level undergraduate engineering and science background with courses in circuits, electronics, and digital logic.

INTRODUCTION TO DIGITAL INTEGRATED CIRCUITS
The Technological Revolution
Electrical Properties of Digital Integrated Circuits
Logic Families
Computer-Aided Design and Verification
Fabrication
Testing and Yield
Packaging
Reliability
Burn-In and Accelerated Testing
Staying Current in the Field
SEMICONDUCTOR MATERIALS
Introduction
Crystal Structure
Energy Bands
Carrier Concentrations
Lifetime
Current Transport
Carrier Continuity Equations
Poisson's Equation
The Dielectric Relaxation Time
DIODES
Introduction
Zero Bias (Thermal Equilibrium)
Forward Bias
Reverse Bias
Switching Transients
Metal-Semiconductor Diode
SPICE Models
Integrated Circuit Diodes
PSPICE Simulations
Laboratory Exercises
BIPOLAR JUNCTION TRANSISTORS
Introduction
The Bipolar Junction Transistor in Equilibrium
DC Operation of the Bipolar Junction Transistor
The Ebers-Moll Model
SPICE Model
Integrated Bipolar Junction Transistors
PSPICE Simulations
Laboratory Exercises
TRANSISTOR-TRANSISTOR LOGIC
Introduction
Circuit Evolution
Using Kirchhoff's Voltage Law (KVL) in TTL Circuits
Voltage Transfer Characteristic
Dissipation
Fan-Out
Propagation Delays
Logic Design
Schottky TTL
PSPICE Simulations: BJT Inverter
PSPICE Simulations: TTL
PSPICE Simulations: LSTTL
Laboratory Exercises
EMITTER-COUPLED LOGIC
Introduction
Circuit Evolution
Using Kirchhoff's Voltage Law with ECL Circuits
Voltage Transfer Characteristics
Dissipation
Propagation Delays
Logic Design
Temperature Effects in ECL
ECL Circuit Families
Active Pull-down ECL (APD ECL)
Low-Voltage ECL (LV-ECL)
PSPICE Simulations
Laboratory Exercises
FIELD EFFECT TRANSISTORS
Introduction
MOS Capacitor
MOSFET Threshold Voltage
Long-Channel MOSFET Operation
Short-Channel MOSFETs
MOSFET SPICE Models
Integrated MOSFETs
PSPICE Simulations
Laboratory Exercises
NMOS LOGIC
Introduction
Circuit Evolution
Voltage Transfer Characteristic
Dissipation
Propagation Delays
Fan-Out
Logic Design
PSPICE Simulations
Laboratory Exercises
CMOS LOGIC
Introduction
Voltage Transfer Characteristic
Short-Circuit Current in CMOS
Propagation Delays
Dissipation
Fan-Out
Logic Design
4000 Series CMOS
74HCxx Series CMOS
Buffered CMOS
Pseudo NMOS
Dynamic CMOS
Domino Logic
Latch-Up in CMOS
Static Discharge in CMOS
Scaling of CMOS
PSPICE Simulations
Laboratory Exercises
LOW-POWER CMOS LOGIC
Introduction
Low-Voltage CMOS
Multiple Voltage CMOS
Dynamic Voltage Scaling
Active Body Biasing
Multiple Threshold CMOS
Adiabatic Logic
Silicon-on-Insulator (SOI)
BiCMOS LOGIC
Introduction
Voltage Transfer Characteristic
Propagation Delays
Rail-to-Rail BiCMOS
Logic Design
PSPICE Simulations
Laboratory Exercises
GaAs DIRECT-COUPLED FET LOGIC
Introduction
Gallium Arsenide versus Silicon
Gallium Arsenide MESFET
Metal Semiconductor Junction
MESFET Pinch-Off Voltage
Long-Channel MESFET Operation
Short-Channel MESFETs
The Curtice Model for the MESFET
MESFET SPICE Model
Integrated MESFETs
Direct-Coupled FET Logic
PSPICE Simulations
INTERFACING BETWEEN DIGITAL LOGIC CIRCUITS
Introduction
Level Shifting Circuits
Wired Logic
Transmission Gates
Tri-State Logic
PSPICE Simulations
Laboratory Exercises
INTERCONNECT
Introduction
Capacitance of Interconnect
Resistance of Interconnect
Inductance of Interconnect
Lumped Capacitance Model
Distributed Models
Transmission Line Model
Special Problems in Interconnect Design
PSPICE Simulations
BISTABLE CIRCUITS
Introduction
RS Latch
RS Flip Flop
JK Flip Flops
Other Flip Flops
Schmitt Triggers
PSPICE Simulations
Laboratory Exercises
DIGITAL MEMORIES
Introduction
Static Random Access Memory (SRAM)
Dynamic Random Access Memory (DRAM)
Read Only Memory (ROM)
Programmable Read Only Memory (PROM)
Erasable Programmable Read Only Memory (EPROM)
Electrically Erasable Programmable Read Only Memory (EEPROM)
Flash Memory
Access Times in Digital Memories
Emerging Memory Technologies
Design and Layout
Introduction
Photolithography and Masks
Layout and Design Rules
Physical Design of CMOS Circuits
VLSI Design Principles
Integrated Circuit Packages
Introduction
Package Types
General Considerations
Packaging Processes and Materials
Appendix A: Properties of Si and GaAs at 300K
Appendix B: Design Rules, Constants, Symbols, and Definitions
Index

Each chapter also contains Summary, References, and Problems sections.

Erscheint lt. Verlag 15.12.2003
Zusatzinfo 827 equations; 92 Tables, black and white; 682 Illustrations, black and white
Verlagsort Bosa Roca
Sprache englisch
Maße 156 x 235 mm
Gewicht 1134 g
Themenwelt Informatik Grafik / Design Digitale Bildverarbeitung
Technik Elektrotechnik / Energietechnik
ISBN-10 0-8493-1951-X / 084931951X
ISBN-13 978-0-8493-1951-8 / 9780849319518
Zustand Neuware
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