VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things -

VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things

25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers
Buch | Hardcover
XIV, 257 Seiten
2019 | 1st ed. 2019
Springer International Publishing (Verlag)
978-3-030-15662-6 (ISBN)
83,46 inkl. MwSt
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. 
The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.


Erscheinungsdatum
Reihe/Serie IFIP Advances in Information and Communication Technology
Zusatzinfo XIV, 257 p. 181 illus., 145 illus. in color.
Verlagsort Cham
Sprache englisch
Maße 155 x 235 mm
Gewicht 565 g
Themenwelt Mathematik / Informatik Informatik Netzwerke
Informatik Weitere Themen Hardware
Schlagworte Applications • Artificial Intelligence • Computer-Aided Design (CAD) • Computer Architecture • Computer Science • computer vision • conference proceedings • Field Programmable Gate Array (FPGA) • Hardware • Informatics • Integrated Circuits • Internet • Internet of Things (IoT) • Logic Gates • Microprocessor chips • Processors • Research • sensors • ubiquitous computing • User Interfaces • VLSI circuits
ISBN-10 3-030-15662-1 / 3030156621
ISBN-13 978-3-030-15662-6 / 9783030156626
Zustand Neuware
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Buch | Softcover (2023)
Springer (Verlag)
24,99