VLSI-SoC: At the Crossroads of Emerging Trends -

VLSI-SoC: At the Crossroads of Emerging Trends

21st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2013, Istanbul, Turkey, October 6-9, 2013, Revised Selected Papers
Buch | Hardcover
XIV, 267 Seiten
2015 | 1st ed. 2015
Springer International Publishing (Verlag)
978-3-319-23798-5 (ISBN)
53,49 inkl. MwSt
This book contains extended and revised versions of the best papers presented at the 21st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2013, held in Istanbul, Turkey, in October 2013. The 11 papers included in the book were carefully reviewed and selected from the 48 full papers presented at the conference. An extended version of a previously unpublished high-quality paper from VLSI-SoC 2012 is also included. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
Erscheint lt. Verlag 28.11.2015
Reihe/Serie IFIP Advances in Information and Communication Technology
Zusatzinfo XIV, 267 p.
Verlagsort Cham
Sprache englisch
Maße 155 x 235 mm
Themenwelt Mathematik / Informatik Informatik Netzwerke
Informatik Weitere Themen CAD-Programme
Informatik Weitere Themen Hardware
Schlagworte Applications • CAD • Chip integration • Computer-Aided Design • Computer Architecture • Computer Hardware • Computer Science • Computer System Implementation • conference proceedings • Informatics • Logic Design • Microelectronics Design • Microprocessor chips • Research • System-on-Chip • VLSI circuits
ISBN-10 3-319-23798-5 / 3319237985
ISBN-13 978-3-319-23798-5 / 9783319237985
Zustand Neuware
Haben Sie eine Frage zum Produkt?
Mehr entdecken
aus dem Bereich
Band 1: Produktion

von Thomas Bauernhansl

Buch | Hardcover (2024)
Springer Vieweg (Verlag)
99,99
Einführung in die Geometrische Produktspezifikation

von Daniel Brabec; Ludwig Reißler; Andreas Stenzel

Buch | Softcover (2023)
Europa-Lehrmittel (Verlag)
20,70