1996 International Conference on Simulation of Semiconductor Processes and Devices -  IEEE Electron Devices Society

1996 International Conference on Simulation of Semiconductor Processes and Devices

Sispad '96, September 2-4, 1996, Toyo University, Hakusan Campus, Tokyo, Japa
Buch | Softcover
184 Seiten
1996
I.E.E.E.Press (Verlag)
978-0-7803-2745-0 (ISBN)
107,85 inkl. MwSt
  • Keine Verlagsinformationen verfügbar
  • Artikel merken
This conference is aimed at providing an opportunity for the presentation and discussion of the recent topics in process, device and circuit modeling for semiconductors. The proceedings contains all papers presented at the conference which are carefully selected by experts in the field. A valuable source and indispensable for all scientists and engineers engaged in research and development in semiconductor devices, the proceedings include a wide range of TCAD algorithms to user interfacesProcess Modeling; Impurity Modeling; Future Device Modeling; Advanced Silicon Device Modeling; Equipment and Topography Modeling; Mesh Generation and Circuit Model
Erscheint lt. Verlag 31.12.1996
Zusatzinfo illustrations
Verlagsort Piscataway NJ
Sprache englisch
Maße 216 x 298 mm
Gewicht 408 g
Themenwelt Informatik Grafik / Design Digitale Bildverarbeitung
Technik Elektrotechnik / Energietechnik
ISBN-10 0-7803-2745-4 / 0780327454
ISBN-13 978-0-7803-2745-0 / 9780780327450
Zustand Neuware
Haben Sie eine Frage zum Produkt?
Mehr entdecken
aus dem Bereich
alles zum Drucken, Scannen, Modellieren

von Werner Sommer; Andreas Schlenker

Buch | Softcover (2024)
Markt + Technik Verlag
24,95
Das umfassende Handbuch

von Michael Moltenbrey

Buch | Hardcover (2024)
Rheinwerk (Verlag)
39,90