Focus on Semiconductor Research
Seiten
2005
Nova Science Publishers Inc (Verlag)
978-1-59454-416-3 (ISBN)
Nova Science Publishers Inc (Verlag)
978-1-59454-416-3 (ISBN)
Examines the physics of semiconductor electronic and optoelectronic devices, including theoretical modelling and experimental demonstration. This book includes studies of the structural, electrical, optical and acoustical properties of bulk, low-dimensional and amorphous semiconductors; computational semiconductor physics; and more.
This book includes within its scope studies of the structural, electrical, optical and acoustical properties of bulk, low-dimensional and amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal-semiconductor and insulator-semiconductor junctions; all multi-layered structures involving semiconductor components. Dopant incorporation. Growth and preparation of materials, including both epitaxial (e.g. molecular beam and chemical vapour methods) and bulk techniques; in situ monitoring of epitaxial growth processes, also included are appropriate aspects of surface science such as the influence of growth kinetics and chemical processing on layer and device properties. The physics of semiconductor electronic and optoelectronic devices are examined , including theoretical modelling and experimental demonstration; all aspects of the technology of semiconductor device and circuit fabrication. Relevant areas of 'molecular electronics' and semiconductor structures incorporating Langmuir- Blodgett films; resists, lithography and metallisation where they are concerned with the definition of small geometry structure. The structural, electrical and optical characterisation of materials and device structures are also included. The scope encompasses materials and device reliability: reliability evaluation of technologies; failure analysis and advanced analysis techniques such as SEM, E-beam, optical emission microscopy, acoustic microscopy techniques; liquid crystal techniques; noise measurement, reliability prediction and simulation; reliability indicators; failure mechanisms, including charge migration, trapping, oxide breakdown, hot carrier effects, electro-migration, stress migration; package- related failure mechanisms; effects of operational and environmental stresses on reliability.
This book includes within its scope studies of the structural, electrical, optical and acoustical properties of bulk, low-dimensional and amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal-semiconductor and insulator-semiconductor junctions; all multi-layered structures involving semiconductor components. Dopant incorporation. Growth and preparation of materials, including both epitaxial (e.g. molecular beam and chemical vapour methods) and bulk techniques; in situ monitoring of epitaxial growth processes, also included are appropriate aspects of surface science such as the influence of growth kinetics and chemical processing on layer and device properties. The physics of semiconductor electronic and optoelectronic devices are examined , including theoretical modelling and experimental demonstration; all aspects of the technology of semiconductor device and circuit fabrication. Relevant areas of 'molecular electronics' and semiconductor structures incorporating Langmuir- Blodgett films; resists, lithography and metallisation where they are concerned with the definition of small geometry structure. The structural, electrical and optical characterisation of materials and device structures are also included. The scope encompasses materials and device reliability: reliability evaluation of technologies; failure analysis and advanced analysis techniques such as SEM, E-beam, optical emission microscopy, acoustic microscopy techniques; liquid crystal techniques; noise measurement, reliability prediction and simulation; reliability indicators; failure mechanisms, including charge migration, trapping, oxide breakdown, hot carrier effects, electro-migration, stress migration; package- related failure mechanisms; effects of operational and environmental stresses on reliability.
Preface: Size Dependent Thermodynamic and Kinetic Characterisations of Semiconductor; Structure-Property Relations in Transition Metal Stabilised Mercury Cuprate Superconductors; Thermally Stimulated Current Observation of Trapping Centers in Layered Thallium Dichalcogenide Semiconductors; Electron Waveguide Based Interference Filter in Semiconductors with Multiple Quantum Well Structure; Radiation Effects in Wide-Bandgap Semiconductors; DC Modelling of HFETs; Study of Electron Quasi-Fermi Level Splitting of Heterojunction Bipolar Transistors Using a General Quasi-Analytical Model; Index.
Erscheint lt. Verlag | 4.7.2005 |
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Zusatzinfo | Illustrations |
Verlagsort | New York |
Sprache | englisch |
Maße | 260 x 180 mm |
Gewicht | 694 g |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
ISBN-10 | 1-59454-416-6 / 1594544166 |
ISBN-13 | 978-1-59454-416-3 / 9781594544163 |
Zustand | Neuware |
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