Rheology, Physical and Mechanical Behavior of Materials 2

Maurice Leroy is a lecturer and professor at the University of Nantes, France, as well as director of the Composite and Metallic Formations research laboratory at the IUT. He was instrumental in the creation of France’s first Materials Science and Engineering department.

Preface ix

Chapter 1 Dynamics from Electromagnetic Effects 1

1.1 Electromagnetic shocks and applications 1

1.1.1 Introduction 1

1.1.2 Electromagnetic shocks 2

1.1.3 Magnetic field and induced current in metals 9

1.1.4 Current and magnetic field measurement 18

1.1.5 Skin thickness 19

1.1.6 Electromagnetic pressure 20

1.1.7 Orders of magnitude of the magnetic field and the electromagnetic energy density to obtain a deformation 21

1.2 Deformation by electromagnetic pulses 23

1.2.1 Displacement, kinetic energy and deformation rate 23

1.2.2 Pulse of the electromagnetic stress 31

1.2.3 Publications 43

Chapter 2 Dynamics from Electrohydraulic Effects 59

2.1 Introduction 59

2.2 Forming tanks 60

2.3 The electrohydraulic effect 62

2.3.1 Primary shock wave and secondary pressure waves 65

2.4 Actions of the wave pressures in the fluid: fluid-plate acoustic effect 69

2.4.1 Fluid-plate interaction 69

2.5 Electrohydraulic forming 73

Chapter 3 Elastic Limit Deflection, Plastic Hinge, Dynamics of Movement 77

3.1 Plastic bending 77

3.1.1 Case: doubly symmetrical shaped section beam 77

3.1.2 Any potential section with double symmetry 78

3.2 Plastic hinges 82

3.2.1 The case of rectangular beams or sheets 83

3.2.2 Dynamic in distributed loading of rectangular beams or sheets 91

3.2.3 Bending of circular plates: bending of symmetrically uniformly loaded circular plates 102

3.2.4 Electrodynamics and hydrodynamics of plates 117

Chapter 4 Dynamic Actions, Technologies and Applications 125

4.1 Mechanical shocks 125

4.1.1 Structural memory 125

4.1.2 Dynamic powder compacting, sintering 138

4.2 Electromagnetic shocks and applications 169

4.2.1 Shock inductors 169

4.2.2 Dynamic assemblies 192

4.3 Dynamic plating solders 208

4.3.1 Introduction 208

4.3.2 Magnetic welding 211

4.3.3 Plate dynamics 216

4.3.4 Micrographs of the solders obtained by the electromagnetic impact and an analysis of the connection 219

4.3.5 Electrohydraulic soldering 221

Appendices 227

Appendix A: Electromagnetism 229

Appendix B : Joining, Dynamic Hooping: Transmissible Force and Torque 257

Appendix C: Tables of Characteristics of Metals 273

Appendix D: Publications 281

References 303

Index 305