Polymeric Thermosetting Compounds
Apple Academic Press Inc. (Verlag)
978-1-77463-599-5 (ISBN)
Author Ralph Hermansen, with years of experience of hands-on experience, is an expert in formulating epoxies, polyurethanes, and other polymers into compounds that have unique properties, and here he shares his knowledge and experience of attaining novel solutions to very challenging problems. He covers polymeric compounds such as coatings, adhesives, encapsulants, transparent plastics, and others.
Chapters describe the design problem and define which key properties are sought in the new material. The author shares his thinking about how to approach the formulating problem and describes the experimental procedures used to eventually solve the problem. Patent information is shared as well. Once a new family of polymeric compounds is developed, that technology can be used to attack new unsolved materials problems, or "spin-offs," and real-life examples are provided to help readers see new applications of the technologies described in the earlier chapters.
The book will be of interest to a diverse group of people. Industry professionals already in the business of selling specialty compounds may be able to add new products to their catalogs with little research cost or time by using the information in the book. Formulators, trying to develop a new compound to challenging requirements, may gain insight into how to make a breakthrough. The information in the book will be very valuable to companies needing these novel solutions. And younger people wondering what a career in materials science would be like get a first-hand commentary from someone who has done it.
Ralph D. Hermansen was formerly Senior Scientist at Hughes Aircraft Company in El Segundo, California. He was very active in the Society for the Advancement of Materials and Processes Engineering (SAMPE) and has presented papers annually and attended many seminars and sessions. He has 21 patent awards and won best inventor award in 1991 from Hughes Aircraft Company. He has taught courses at HAC as an instructor in their Advanced Technical Education Program (ATEP) for several years materials engineering and Pascal Programming Language and is the author of Formulating Plastics and Elastomers by Computer (Elsevier). Mr. Hermansen was known nationwide as one to see with challenging material problems. Anxious clients, from as far across the continent, traveled to seek his help with "unsolvable problems." He currently reviews books in his field.
Preface. Custom Formulating. Materials and Process Engineering. The Art and Science of Formulating. Thermal Transfer Adhesives for Space Electronics. Thermal-Transfer Filleting Adhesives. Flexible Epoxy Thermal-Transfer Adhesives for Flatpacks. More About the New Thermal Transfer Adhesives. Superior Thermal Transfer Adhesive. Other Custom-Formulated Compounds for Aerospace Electronics Applications. Radio-Opaque Adhesive/Sealant. Low Exotherm, Low-Temperature-Curing Epoxy Impregnants. Platable Adhesives for Cyanate Ester Composites. Reworkable, Thermally-Conductive Adhesives for Electronic Assemblies. Room-Temperature-Stable, One-Component, Flexible Epoxy Adhesives. Custom-Formulated Compounds for Automotive Electronics Applications. Air Bag Sensor Encapsulation. Reactive Hot Melt Conformal Coating Materials. Solder Joint Lead Encapsulation. Custom-Formulated Organic Solder to Eliminate Lead. Formulation of a Drop-Resistant Organic Solder. Rigid Polyurethanes for Aircraft Transparencies. Sierraclad™ Bird-Proof Canopies and Windshields. Three Niche Technologies. Flexipoxy Technology. Hacthane Technology. Transparent Polyurethane Plastics. Spin-Off Applications. Spin-off from Our Thermal Transfer Adhesives Patents. Spin-off from Our Electrically-Conductive Adhesives Patents. Spin-off from Our Encapsulants, Potting Compounds and Impregnants Patents. Spin-Off from Our High Volume Electronic Assembly Materials Patents. Spin-off from Our Specialty Adhesives Patents. Spin-off from Our Specialty Rigid Thermosets Patents. Appendix I: The Science of Rubbery Materials. Index.
| Erscheinungsdatum | 06.04.2021 |
|---|---|
| Zusatzinfo | 35 Illustrations, black and white |
| Verlagsort | Oakville |
| Sprache | englisch |
| Maße | 152 x 229 mm |
| Gewicht | 453 g |
| Themenwelt | Naturwissenschaften ► Chemie ► Organische Chemie |
| Technik ► Maschinenbau | |
| ISBN-10 | 1-77463-599-2 / 1774635992 |
| ISBN-13 | 978-1-77463-599-5 / 9781774635995 |
| Zustand | Neuware |
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