Handbook of Silicon Based MEMS Materials and Technologies (eBook)
826 Seiten
Elsevier Science (Verlag)
978-0-323-31223-3 (ISBN)
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques- Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs- Discusses properties, preparation, and growth of silicon crystals and wafers- Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures- Geared towards practical applications rather than theory
List of Contributors
Timo Aalto, VTT Technical Research Centre of Finland LTD, Espoo, Finland
Veli-Matti Airaksinen, IMARINS, Espoo, Finland
Marco Amiotti, SAES Getters S.p.A., Lainate, Italy
Olli Anttila, Silicom Ltd., Helsinki, Finland
Antonio Bonucci, SAES Getters S.p.A., Lainate, Italy
K. Brudziński, The Nordic Hysitron Laboratory, Helsinki University of Technology, Espoo, Finland
Rob N. Candler, Department of Electrical Engineering, University of California, Los Angeles, USA
Zhen Cao, Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong
Kuo-Shen Chen, Department of Mechanical Engineering, National Cheng-Kung University Tainan, Tainan, Taiwan
Andrea Conte, SAES Getters S.p.A., Lainate, Italy
Cristina E. Davis, Department of Mechanical and Aerospace Engineering, University of California, Davis, USA
Pradeep Dixit, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, India
Viorel Dragoi, EV Group E.Thallner GmbH, St. Florian/Inn, Austria
Simo Eränen, VTT Technical Research Centre of Finland LTD, Espoo, Finland
Andreas C. Fischer, Department of Micro and Nanosystems, KTH Royal Institute of Technology, Stockholm, Sweden
Sami Franssila, Department of Materials Science and Engineering, Aalto University, Espoo, Finland
Alois Friedberger, EADS Innovation Works, München, Germany
Maria Ganchenkova, Department of Applied Physics, Aalto University, Espoo, Finland
Pilar Gonzalez, Interuniversity Microelectronics Centre (IMEC), Leuven, Belgium
Miguel A. Gosálvez, Laboratory of Physics, Aalto University, Espoo, Finland
J. Gronicz, The Nordic Hysitron Laboratory, Helsinki University of Technology, Espoo, Finland
Atte Haapalinna, Okmetic Oyj, Vantaa, Finland
Paul M. Hagelin, SiTime Corporation, Sunnyvale, USA
Paul Hammond, SPTS Technologies, Allentown, USA
Kimmo Henttinen, Okmetic Oyj, Vantaa, Finland
David Horsley, Department of Mechanical and Aerospace Engineering, University of California, Davis, USA
Akihisa Inoue, Institute for Materials Research, Tohoku University, Sendai, Japan
Henrik Jakobsen, Department of Micro and Nano Systems Technology, Buskerud and Vestfold University College, Borre, Norway
Kerstin Jonsson, NanoSpace AB, Uppsala Science Park, Uppsala, Sweden
Dirk Kähler, Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany
Hannu Kattelus, VTT MEMSFAB, Espoo, Finland
Roy Knechtel, X-FAB MEMS Foundry GmbH Erfurt, Haarbergstraβe, Germany
Kathrin Knese, Robert Bosch GmbH, Automotive Electronics, Reutlingen, Germany
Kai Kolari
VTT Technical Research Centre of Finland LTD, Espoo, Finland
currently at Murata Electronics, Vantaa, Finland
Mika Koskenvuori, Nanofab, Micronova, Aalto University, Espoo, Finland
Heikki Kuisma, Murata Electronics Oyj, Vantaa, Finland
Amit Kulkarni, Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany
Franz Laermer, Robert Bosch GmbH Stuttgart, Germany, Applied Research 1, Microsystems Technologies
Adriana Cozma Lapadatu, poLight AS, Horten, Norway
Christina Leinenbach, Robert Bosch GmbH, Stuttgart, Germany
Michael K. LeVasseur, Department of Mechanical and Aerospace Engineering, University of California, Davis, USA
Jue Li, Department of Electrical Engineering and Automation, Aalto University, Espoo, Finland
Paul Lindner, EV Group E.Thallner GmbH, St. Florian/Inn, Austria
Veikki Lindroos, Department of Materials Science and Engineering, Aalto University, Espoo, Finland
Fabian Lofink, Fraunhofer Institute for Silicon Technology (ISIT), Itzehoe, Germany
Giorgio Longoni, SAES Getters S.p.A., Lainate, Italy
Jari Mäkinen, Okmetic Oyj, Vantaa, Finland
Matti Mäntysalo, Department of Electronics and Communications Engineering, Tampere University of Technology, Tampere, Finland
Devin Martin, DISCO HI-TEC America, Inc., Santa Clara, USA
Toni Mattila, Department of Electrical Engineering and Automation, Aalto University, Espoo, Finland
Luca Mauri, SAES Getters S.p.A., Lainate, Italy
Peter Merz, XFAB MEMS Foundry GmbH, Itzehoe, Germany
Doug Meyer, Gallia Semiconductor, Portland, USA
Marco Moraja, SAES Getters S.p.A., Lainate, Italy
Teruaki Motooka, Department of Materials Science and Engineering, Kyushu University, Fukuoka, Japan
Gerhard Müller, EADS Innovation Works, München, Germany
Paul Muralt, EPFL, Lausanne, Switzerland
S. Nagao, The Nordic Hysitron Laboratory, Helsinki University of Technology, Espoo, Finland
Risto M. Nieminen, Department of Applied Physics, Aalto University, Espoo, Finland
Frank Niklaus, Department of Micro and Nanosystems, KTH Royal Institute of Technology, Stockholm, Sweden
R. Nowak, Department of Materials Science and Engineering and The Nordic Hysitron Laboratory, Aalto University, Espoo, Finland
Juuso Olkkonen, VTT Technical Research Centre of Finland LTD, Espoo, Finland
Kuang-Shun Ou, Department of Mechanical Engineering, National Cheng-Kung University Tainan, Tainan, Taiwan
Jari Paloheimo, Okmetic Oyj, Vantaa, Finland
Mervi Paulasto-Kröckel, Department of Electrical Engineering and Automation, Aalto University, Espoo, Finland
Helena Pohjonen, Nokia Technologies, Espoo, Finland
Klaus Pressel, Infineon Technologies AG, Regensburg, Germany
Matti Putkonen, VTT Technical Research Centre of...
Erscheint lt. Verlag | 2.9.2015 |
---|---|
Sprache | englisch |
Themenwelt | Technik ► Bauwesen |
Technik ► Elektrotechnik / Energietechnik | |
Technik ► Maschinenbau | |
ISBN-10 | 0-323-31223-3 / 0323312233 |
ISBN-13 | 978-0-323-31223-3 / 9780323312233 |
Haben Sie eine Frage zum Produkt? |
Größe: 30,6 MB
Kopierschutz: Adobe-DRM
Adobe-DRM ist ein Kopierschutz, der das eBook vor Mißbrauch schützen soll. Dabei wird das eBook bereits beim Download auf Ihre persönliche Adobe-ID autorisiert. Lesen können Sie das eBook dann nur auf den Geräten, welche ebenfalls auf Ihre Adobe-ID registriert sind.
Details zum Adobe-DRM
Dateiformat: EPUB (Electronic Publication)
EPUB ist ein offener Standard für eBooks und eignet sich besonders zur Darstellung von Belletristik und Sachbüchern. Der Fließtext wird dynamisch an die Display- und Schriftgröße angepasst. Auch für mobile Lesegeräte ist EPUB daher gut geeignet.
Systemvoraussetzungen:
PC/Mac: Mit einem PC oder Mac können Sie dieses eBook lesen. Sie benötigen eine
eReader: Dieses eBook kann mit (fast) allen eBook-Readern gelesen werden. Mit dem amazon-Kindle ist es aber nicht kompatibel.
Smartphone/Tablet: Egal ob Apple oder Android, dieses eBook können Sie lesen. Sie benötigen eine
Geräteliste und zusätzliche Hinweise
Buying eBooks from abroad
For tax law reasons we can sell eBooks just within Germany and Switzerland. Regrettably we cannot fulfill eBook-orders from other countries.
aus dem Bereich