The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Springer (Verlag)
978-0-7923-8485-4 (ISBN)
1. An Introduction to Plastic Packaging.- 1.1 Manufacturing sequence for a PQFP.- 1.2 Properties of packaging materials.- 1.3 Stress induced failures of plastic packages.- References.- 2. A Review of Package Stress Modelling.- 2.1 Introduction.- 2.2 Analytical approaches to package modelling.- 2.3 Finite element methods.- References.- 3. Thermomechanical Stress in a PQFP.- 3.1 Introduction.- 3.2 Origin of thermomechanical stress in TCE mismatched materials.- 3.3 Finite element analysis of a PQFP.- 3.4 2D representation of a 3D structure.- 3.5 Interpretation of die encapsulation stress.- 3.6 Mechanism of stress transfer.- 3.7 Deformation of the package structure.- 3.8 Die surface compressive stress distribution.- 3.9 Material and geometric factors which influence encapsulation stress.- References.- 4. The Correlation of Modelling with Measurements and Failure Modes.- 4.1 Introduction.- 4.2 Measurement of die stress with stress sensors.- 4.3 Simulated die surface stress.- 4.4 Comparison between measured and modelled encapsulation stress.- 4.5 Analytical model.- 4.6 The correlation of simulations with failure modes.- 4.7 Influence of delamination on stress.- 4.8 Analysis of stress in a wire bond.- References.- 5. Accurate Prediction of PQFP Warpage.- 5.1 Introduction.- 5.2 Warpage of a 208 lead power PQFP package.- 5.3 Variation of power PQFP warpage with temperature.- 5.4 Significance of chemical shrinkage for asymmetric packages.- 5.5 Warpage of a small body size PQFP.- 5.6 Warpage of a large body size PQFP.- 5.7 Warpage sensitivity of both large and small body size PQFPs.- 5.8 Asymmetric structure of BGA packages.- References.- 6. Microsystem Packaging in Plastic and in 3D.- 6.1 Introduction.- 6.2 Microsystem packaging — Lessons from IC packaging.- 6.3 3D packagingmethodologies.- 6.4 3D microsystem packaging — a European example.- 7. Concluding Remarks.- 7.1 Problems remaining to be solved.- 7.2 A comment on the numerical tools.- 7.3 For the Future.- References.- References.- Appendices.- A- Analytical model of encapsulation stress.- A.1 Force equilibrium.- A.2 Strain compatibility.- B- Fundamentals of stress and strain.- B.1 Direct and shear stress conventions.- B.2 Longitudinal strain and Poisson’s ratio.- C- Axial stress and bending stress.
Zusatzinfo | XIX, 134 p. |
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Verlagsort | Dordrecht |
Sprache | englisch |
Maße | 170 x 244 mm |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
ISBN-10 | 0-7923-8485-7 / 0792384857 |
ISBN-13 | 978-0-7923-8485-4 / 9780792384854 |
Zustand | Neuware |
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