Nanopackaging
Springer International Publishing (Verlag)
978-3-319-90361-3 (ISBN)
lt;p>This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
James E. Morris is Professor of Electrical & Computer Engineering at Portland State University, Oregon. He has edited or co-authored five books on electronic packaging, and has more on the way.
Nanopackaging: Nanotechnologies and Electronics Packaging.- Modelling Technologies and Applications.- Advances in Delamination Modeling: Continuum Aspects.- Advances in Delamination Modeling: Atomistic Aspects.- Soft Mold Nano-imprint: Modeling and Simulation.- Nanoparticle Properties.- Nanoparticle Fabrication.- Nanoparticle-based High-k Dielectric Composites for Embedded Capacitors.- Nanostructured Materials for Embedded Resistors.- Nanogranular Magnetic Core Inductors: Design, Fabrication and Packaging.- Nanoparticles in Isotropic Conductive Adhesives.- Nano materials in Anisotropic Conductive Adhesives (ACAs).- Nanoparticles in Microvias.- Silver Nanoparticles for Inkjet Printed Conductive Structures in Electronic Packaging.- A Study of Nano Particles in SnAg-Based Lead Free Solders.- Nano-Underfills for Fine Pitch Electronics.- Carbon Nanotubes: Synthesis and Characterization.- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications.- High Electromagnetic Shielding of Plastic Transceiver Packaging Using Dispersed Multiwall Carbon Nanotubes.- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced with Single-Wall Carbon Nanotubes.- Carbon Nanotubes for Thermal Management of Microsystems.- Nanowires in Electronics Packaging.- Nanowire ACF for Ultrafine pitch Flip-Chip Interconnection.- Synthesis and Optical Characterization of CVD Graphene.- Characterization of electronic, electrical, optical and mechanical properties of grapheme.- Graphene for Thermal Cooling of Microelectronics.- Carbon Interconnects.- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging.- Nanosensors for Electronics Package Reliability.- Applications of Bio-Nanotechnology to Electronics Packaging.- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities.- Nanotechnology Health, Safety, Environment Overview.
| Erscheinungsdatum | 04.10.2018 |
|---|---|
| Zusatzinfo | XXVIII, 996 p. 635 illus., 419 illus. in color. |
| Verlagsort | Cham |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Gewicht | 1694 g |
| Themenwelt | Naturwissenschaften ► Chemie ► Physikalische Chemie |
| Technik ► Elektrotechnik / Energietechnik | |
| Technik ► Maschinenbau | |
| Schlagworte | Carbon Nanotubes • Conductive Microstructures • nanocomposite resistors • nanoelectronics • nanomaterials • Nanoparticle fabrication • Thermal Cooling and Management |
| ISBN-10 | 3-319-90361-6 / 3319903616 |
| ISBN-13 | 978-3-319-90361-3 / 9783319903613 |
| Zustand | Neuware |
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