List of Contributors

Hiroshi Amano,     Department of Electrical Engineering and Computer Science, Akasaki Research Center, Nagoya University, Nagoya, Japan

Yamina André

Clermont Université, Université Blaise Pascal, Institut Pascal, Clermont-Ferrand, France

CNRS, UMR 6602, Aubière, France

Hajime Asahi,     The Institute of Scientific and Industrial Research, Osaka University, MIHOGAKA, IBARAKI, Osaka, Japan

John E. Ayers,     Electrical and Computer Engineering Department, University of Connecticut, Storrs, CT, USA

Michael J. Aziz,     Harvard School of Engineering and Applied Sciences, Cambridge, MA, USA

Bhavtosh Bansal,     Dept. of Physical Sciences, Indian Institute of Science Education and Research Kolkata, India

Arnab Bhattacharya,     Dept. of Condensed Matter Physics and Materials Science, Tata Institute of Fundamental Research, Mumbai, India

Robert M. Biefeld,     Sandia National Laboratories, Albuquerque, NM, USA

A.A. Bol,     Department of Applied Physics, Eindhoven University of Technology, Eindhoven, The Netherlands

April S. Brown,     Department of Electrical and Computer Engineering, Pratt School of Engineering, Duke University, Durham, NC, USA

Robert Cadoret

Clermont Université, Université Blaise Pascal, Institut Pascal, Clermont-Ferrand, France

CNRS, UMR 6602, Aubière, France

Jeffrey G. Cederberg,     Sandia National Laboratories, Albuquerque, NM, USA

Xiaogang Chen,     Department of Electrical and Computer Engineering, University of Illinois, Urbana, IL, USA

Enrique D. Cobas,     Materials Science and Technology Division, U.S. Naval Research Laboratory, SW Washington, DC, USA

James J. Coleman,     Department of Electrical and Computer Engineering, University of Illinois, Urbana, IL, USA

Armin Dadgar,     Institute of Experimental Physics, Otto-von-Guericke-Universität Magdeburg, Magdeburg, Germany

Paul G. Evans,     Materials Science and Engineering, University of Wisconsin–Madison, Madison, WI, USA

Roberto Fornari,     Department of Physics and Earth Sciences, University of Parma, Parma, Italy

Hiroshi Fujioka,     Institute of Industrial Science, The University of Tokyo

D. Kurt Gaskill,     U.S. Naval Research Laboratory, Washington, DC, USA

Evelyne Gil

Clermont Université, Université Blaise Pascal, Institut Pascal, Clermont-Ferrand, France

CNRS, UMR 6602, Aubière, France

Mark S. Goorsky,     UCLA, HSSEAS School of Engineering & Applied Sciences, Department of Materials Science and Engineering, Los Angeles, CA, USA

Brett C. Johnson,     School of Physics, University of Melbourne, Victoria, Australia

W.M.M. Kessels,     Department of Applied Physics, Eindhoven University of Technology, Eindhoven, The Netherlands

Jeong Dong Kim,     Department of Electrical and Computer Engineering, University of Illinois, Urbana, IL, USA

Tsunenobu Kimoto,     Department of Electronic Science and Engineering, Kyoto University, Kyoto, Japan

H.C.M. Knoops,     Department of Applied Physics, Eindhoven University of Technology, Eindhoven, The Netherlands

G. Koblmüller

Materials Department, University of California, Santa Barbara, CA, USA

Walter Schottky Institut and Physik Department, Technische Universität München, Garching, Germany

Daniel D. Koleske,     Sandia National Laboratories, Albuquerque, NM, USA

Alois Krost,     Institute of Experimental Physics, Otto-von-Guericke-Universität Magdeburg, Magdeburg, Germany

Thomas F. Kuech,     Department of Chemical and Biological Engineering, University of Wisconsin–Madison, Madison, WI, USA

J.R. Lang

Materials Department, University of California, Santa Barbara, CA, USA

Electrical Engineering Department, Yale University, New Haven, CT, USA

Hongdong Li,     State Key Laboratory of Superhard Materials, Jilin University, Changchun, Jilin, China

Xiuling Li,     Department of Electrical and Computer Engineering, Micro and Nanotechnology Laboratory, University of Illinois, Urbana, IL, USA

Maria Losurdo,     National Council of Research, Institute of Inorganic Methodologies and of Plasmas, CNR-IMIP, via Orabona 4, 70126 Bari, Italy

Fumihiro Matsukura

WPI-Advanced Institute for Materials Research, Tohoku University, Sendai, Japan

Center for Spintronics Integrated Systems, Tohoku University, Sendai, Japan

Laboratory for Nanoelectronics and Spintronics, Research Institute of Electrical Communication, Tohoku University, Sendai, Japan

Michael G. Mauk,     College of Engineering, Drexel University, Philadelphia, PA, USA

Jeffrey C. McCallum,     School of Physics, University of Melbourne, Victoria, Australia

Kathleen M. McCreary,     NRC Postdoctoral Fellow Residing at U.S. Naval Research Laboratory, SW Washington, DC, USA

Xin Miao,     Department of Electrical and Computer Engineering, Micro and Nanotechnology Laboratory, University of Illinois, Urbana, IL, USA

Osamu Nakatsuka,     Department of Crystalline Materials Science, Graduate School of Engineering, Nagoya University, Nagoya, Japan

Nathan Newman,     Materials Program, Arizona State University, Tempe, AZ, USA

Tatau Nishinaga,     The University of Tokyo, Japan

Hideo Ohno

WPI-Advanced Institute for Materials Research, Tohoku University, Sendai, Japan

Center for Spintronics Integrated Systems, Tohoku University, Sendai, Japan

Laboratory for Nanoelectronics and Spintronics, Research Institute of Electrical Communication, Tohoku University, Sendai, Japan

S.E. Potts,     Department of Applied Physics, Eindhoven University of Technology, Eindhoven, The Netherlands

Aaron J. Ptak,     National Center for Photovoltaics, National Renewable Energy Laboratory, Golden, CO, USA

Joan M. Redwing,     Department of Materials Science and Engineering, Materials Research Institute, The Pennsylvania State University, PA, USA

Zachary R. Robinson,     ASEE Postdoctoral Fellow Residing at U.S. Naval Research Laboratory, SW Washington, DC, USA

Scott W. Schmucker,     NRC Postdoctoral Fellow Residing at U.S. Naval Research Laboratory, SW Washington, DC, USA

Clemens Simbrunner,     Institute of Semiconductor and Solid State Physics, Johannes Kepler University Linz, Linz, Upper Austria, Austria

Helmut Sitter,     Institute of Semiconductor and Solid State Physics, Johannes Kepler University Linz, Linz, Upper Austria, Austria

Marek Skowronski,     Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA, USA

Josef W. Spalenka,     Materials Science and Engineering, University of Wisconsin–Madison, Madison, WI, USA

J.S. Speck,     Materials Department, University of California, Santa Barbara, CA, USA

Wolfgang Stolz,     Material Sciences Center and Faculty of Physics, Philipps-Universität Marburg, Marburg, Germany

E. Suhir,     ERS Co., Los Altos, CA, USA

Roman Talalaev,     STR Group – Soft-Impact Ltd., St. Petersburg, Russia

Hidekazu Tanaka,     Institute of Scientific and Industrial Research, Osaka University, Osaka, Japan

Agnès Trassoudaine

Clermont Université, Université Blaise Pascal, Institut Pascal, Clermont-Ferrand, France

CNRS, UMR 6602, Aubière, France

Clermont Université, Université d'Auvergne, Institut Pascal, Clermont-Ferrand, France

Mahmoud Vahidi,     Materials Program, Arizona State...