Rapid Thermal Processing for Future Semiconductor Devices -  H. Fukuda

Rapid Thermal Processing for Future Semiconductor Devices (eBook)

(Autor)

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2003 | 1. Auflage
168 Seiten
Elsevier Science (Verlag)
978-0-08-054026-9 (ISBN)
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This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.

This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.

This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.

Front Cover 1
Rapid Thermal Processing for Future Semiconductor Devices 4
Copyright Page 5
CONTENTS 10
Preface 6
RTP2001 Organization 8
Chapter 1. Role of Rapid Thermal Processing in the Development of Disruptive and Non-disruptive Technologies for Semiconductor Manufacturing in the 21st Century 12
Chapter 2. Analytical Model for Spike Annealed Diffusion Profiles of Low-Energy and High-Dose Ion Implanted Impurities 20
Chapter 3. Process and Technology Drivers for Single Wafer Processes in DRAM Manufacturing 28
Chapter 4. Ultra-high vacuum rapid thermal chemical vapor deposition for formation of TiN as barrier metals 40
Chapter 5. Implementations of Rapid Thermal Processes in Polysilicon TFT Fabrication 48
Chapter 6. High-Performance Poly-Si TFT and its Application to LCD 60
Chapter 7. Rapid Low Temperature Photo Oxidation Processing for Advanced Poly-Si TFTs 70
Chapter 8. Properties of Phosphorus-Doped Polycrystalline Silicon Films Formed by Catalytic Chemical Vapor Deposition and Successive Rapid Thermal Annealing 74
Chapter 9. Evaluation of Crystalline Defects in Thin, Strained Silicon-Germanium Epitaxial Layers by Optical Shallow Defect Analyzer 80
Chapter 10. Novel UV-assisted Rapid Thermal Annealing of Ferroelectric Materials 86
Chapter 11. Rapid Thermal Annealing of (l-x)Ta2O5-xTiO2 Thin Films Formed by Metalorganic Decomposition 94
Chapter 12. Hard Breakdown Characteristics in a 2.2-nm-thick SiO2 film 104
Chapter 13. Rapid Thermal MOCVD Processing for InP-Based Devices 110
Chapter 14. Sb Pile-up at the SiO2/Si Interface during Drive-in Process after Predeposition using SOG Source 118
Chapter 15. Large Refractive Index C-S-Au Composite Film Formation by Plasma Processes 126
Chapter 16. The LEVITOR 4000 system, Ultra-fast, Emissivity-independent, heating of substrates via heat conduction through thin gas layers 132
Chapter 17. Steady and Transient Gas Flow Simulation of SiGe Vertical Reactor 140
Chapter 18. The Short-period (Si14/Ge1)20 and (Si28/Ge2)10 superlattices as Buffer Layers for the Growth of Si0.75Ge0.25 Alloy Layers 144
Chapter 19. Si Epitaxial Growth on the Atomic-Order Nitrided Si(l00) Surface in SiH4 Reaction 150
Chapter 20. Heavy Doping Characteristics of Si Films Epitaxially Grown at 450oC by Alternately Supplied PH3 and SiH4 156

Erscheint lt. Verlag 2.4.2003
Sprache englisch
Themenwelt Naturwissenschaften Physik / Astronomie Festkörperphysik
Naturwissenschaften Physik / Astronomie Quantenphysik
Technik Elektrotechnik / Energietechnik
ISBN-10 0-08-054026-0 / 0080540260
ISBN-13 978-0-08-054026-9 / 9780080540269
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