Ultra-thin Chip Technology and Applications
Seiten
2016
|
Softcover reprint of the original 1st ed. 2011
Springer-Verlag New York Inc.
978-1-4939-5118-5 (ISBN)
Springer-Verlag New York Inc.
978-1-4939-5118-5 (ISBN)
Ultra-thin chips are the "smart skin" of a conventional silicon chip. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Fabrication technologies for ultra-thin chips.- Post-processing techniques and issues.- Properties of ultra-thin chips; Applications.
Erscheint lt. Verlag | 23.8.2016 |
---|---|
Zusatzinfo | XXII, 467 p. |
Verlagsort | New York |
Sprache | englisch |
Maße | 155 x 235 mm |
Themenwelt | Informatik ► Weitere Themen ► CAD-Programme |
Technik ► Elektrotechnik / Energietechnik | |
Schlagworte | 3D Integrated Circuits • ChipFilm • Circuit Design • Embedded Systems • microelectronics • microsystems • nanomaterials • nanotechnology • System in Foil • Ultra-thin Chips |
ISBN-10 | 1-4939-5118-1 / 1493951181 |
ISBN-13 | 978-1-4939-5118-5 / 9781493951185 |
Zustand | Neuware |
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