Multiprocessor System-on-Chip
Hardware Design and Tool Integration
Seiten
2014
Springer-Verlag New York Inc.
978-1-4899-8246-9 (ISBN)
Springer-Verlag New York Inc.
978-1-4899-8246-9 (ISBN)
The purpose of this book is to evaluate strategies for future system design in multiprocessor system-on-chip (MPSoC) architectures. Novel trends in MPSoC design, combined with reconfigurable architectures are a main topic of concern. The main emphasis is on architectures, design-flow, tool-development, applications and system design.
The purpose of this book is to evaluate strategies for future system design in multiprocessor system-on-chip (MPSoC) architectures. Both hardware design and integration of new development tools will be discussed. Novel trends in MPSoC design, combined with reconfigurable architectures are a main topic of concern. The main emphasis is on architectures, design-flow, tool-development, applications and system design.
The purpose of this book is to evaluate strategies for future system design in multiprocessor system-on-chip (MPSoC) architectures. Both hardware design and integration of new development tools will be discussed. Novel trends in MPSoC design, combined with reconfigurable architectures are a main topic of concern. The main emphasis is on architectures, design-flow, tool-development, applications and system design.
Part 1: Application Mapping and Communication Infrastructure: Virtualization in NOCs--Enhanced MPSOC Robustness and Performance Verification.-HW Support to Exploit Parallelism in Homogeneous and Heterogeneous Multicore System-on-Chip.-PALLAS: Mapping Applications onto Manycore.-Part 2: Reconfigurable Hardware in Multiprocessor Systems: Adaptive Multiprocessor System on Chip Architecture.-Designing FPGA Systems with Many Processors.-Part 3: Physical Design of Multiprocessor Systems: Design tools and methods for chip physical design.-Challenges in Physical Design for Multi- and Manycore Hardware Architectures.
Erscheint lt. Verlag | 20.9.2014 |
---|---|
Zusatzinfo | VIII, 270 p. |
Verlagsort | New York |
Sprache | englisch |
Maße | 155 x 235 mm |
Themenwelt | Mathematik / Informatik ► Informatik ► Theorie / Studium |
Informatik ► Weitere Themen ► CAD-Programme | |
Technik ► Elektrotechnik / Energietechnik | |
Technik ► Maschinenbau | |
ISBN-10 | 1-4899-8246-9 / 1489982469 |
ISBN-13 | 978-1-4899-8246-9 / 9781489982469 |
Zustand | Neuware |
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