Substrate Noise Coupling in Mixed-Signal ASICs
Springer-Verlag New York Inc.
978-1-4419-5341-4 (ISBN)
Technology Impact on Substrate Noise.- Substrate Noise Generation in Complex Digital Systems.- Modeling and Analysis of Substrate Noise Coupling in Mixed-Signal ICs.- SPACE for Substrate Resistance Extraction.- Models and Parameters for Crosstalk Simulation.- High-Level Simulation of Substrate Noise Generation in Complex Digitlal Systems.- Modeling the Impact of Digital Substrate Noise on Analog Integrated Circuits.- Measuring and Modeling the Effects of Substrate Noise on the LNA for a CMOS GPS Receiver.- A Practical Approach to Modeling Silicon-Crosstalk in Systems-on-Silicon.- The Reduction of Switching Noise Using CMOS Current Steering Logic.- Low-Noise Digital Design Techniques.- How to Deal with Substrate Bounce in Analog Circuits in Epi-Type CMOS Technology.- Reducing Substrate Bounce in CMOS RF-Circuitry.
Erscheint lt. Verlag | 7.12.2010 |
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Zusatzinfo | XXXI, 287 p. |
Verlagsort | New York, NY |
Sprache | englisch |
Maße | 155 x 235 mm |
Themenwelt | Informatik ► Weitere Themen ► CAD-Programme |
Technik ► Elektrotechnik / Energietechnik | |
ISBN-10 | 1-4419-5341-8 / 1441953418 |
ISBN-13 | 978-1-4419-5341-4 / 9781441953414 |
Zustand | Neuware |
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