Electronic Packaging of High Speed Circuitry

Stephen G. Konsowski has 34 years of electronic packaging engineering experience. Retired from Westinghouse as an an advisory engineer, he is now associated with Technology Seminars, Inc. of Lutherville, Maryland. He is a founding member of the Intenrational Electronics Packaging Society (IEPS) and one of its former directors. Mr. Konsowski has authored many technical papers and articles on electronic packaging, including a chapter for the Second Edition of McGraw-Hill's Handbook of Electronic Materials and Processes and Handbook of Packaging and Interconnection. Arden R. Helland is an advisory engineer at the Northrop Grumman Corporation's Electronic Sensors and Systems Division with over 35 years of experience in all phases of electrical design for advanced electronic systems. He is the author of the chapter on the reliability digital systems for the McGraw-Hill Computer Engineering Handbook.

High Speed Digital and Microwave Packaging.Fundamentals of Electricity and Magnetism Applied to Electromagnetics.Packaging Technologies for High Speed Digital and Microwave Circuits.Practical Design Details for Microwave Circuit Packaging.Microwave Circuit Assembly and Development.Transmission Lines: Effects and Analysis.Ideal Transmission Lines.Transmission-Line Interconnections: Load and Ends.Signal Reflections, Bandwidth, and Losses.Transmission Lines: Reflection Diagrams.Transmission Lines: Signal Levels.Interconnections: Routing to Critical Signals.ECL Transmission Lines and Terminations.Differential Line Drivers and Terminations.