1997 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (Ipfa)

IEEE Electron Devices Society, IEEE Reliability Society, Institute of Electrical & Electronics Engineers, IEEE (Autoren)

Buch | Softcover

240 Seiten

1997 | 1997 ed.
I.E.E.E.Press (Verlag)
978-0-7803-3985-9 (ISBN)

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Failure analysis and reliability improvement are linked for improvement of microcircuits packaging by these technical papers. Design factors such as oxide reliability, electromigration and die metallization are considered in testing, and analytic approaches to improved reliability.

Erscheint lt. Verlag	31.10.1997
Verlagsort	Piscataway NJ
Sprache	englisch
Maße	216 x 279 mm
Themenwelt	Technik ► Elektrotechnik / Energietechnik
ISBN-10	0-7803-3985-1 / 0780339851
ISBN-13	978-0-7803-3985-9 / 9780780339859
Zustand	Neuware