Design, Simulation and Applications of Inductors and Transformers for Si RF ICs - Ali M. Niknejad, Robert G. Meyer

Design, Simulation and Applications of Inductors and Transformers for Si RF ICs

Buch | Softcover
190 Seiten
2013 | Softcover reprint of the original 1st ed. 2000
Springer-Verlag New York Inc.
978-1-4757-7366-8 (ISBN)
213,99 inkl. MwSt
These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Accurate knowledge of inductance values, quality factor (Q) and the influence of ad- cent elements (on-chip proximity effects) and substrate losses is essential.
The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency range. One tool which has assisted designers in satisfying these requirements is the use of on-chip inductiveelements (inductors and transformers) in silicon (Si) radio-frequency (RF) integrated circuits (ICs). These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Inductors can be used to improve the intermodulation distortion performance and noise figure of small-signal amplifiers and mixers. In addition, the gain of amplifier stages can be enhanced and the realization of low-cost on-chip local oscillators with good phase noise characteristics is made feasible. In order to reap these benefits, it is essential that the IC designer be able to predict and optimize the characteristics of on-chip inductiveelements. Accurate knowledge of inductance values, quality factor (Q) and the influence of ad- cent elements (on-chip proximity effects) and substrate losses is essential. In this book the analysis, modeling and application of on-chip inductive elements is considered. Using analyses based on Maxwells equations, an accurate and efficient technique is developed to model these elements over a wide frequency range. Energy loss to the conductive substrate is modeled through several mechanisms, including electrically induced displacement and conductive c- rents and by magnetically induced eddy currents. These techniques have been compiled in a user-friendly software tool ASITIC (Analysis and Simulation of Inductors and Transformers for Integrated Circuits).

Analysis and Simulation of Passive Devices.- Problem Description.- Previous Work.- Electromagnetic Formulation.- Inductance Calculations.- Calculation of Eddy Current Losses.- Asitic.- Experimental Study.- Applications of Passive Devices.- Voltage Controlled Oscillators.- Distributed Amplifiers.- Conclusion.

Erscheint lt. Verlag 14.3.2013
Reihe/Serie The Springer International Series in Engineering and Computer Science ; 586
Zusatzinfo XXII, 190 p.
Verlagsort New York, NY
Sprache englisch
Maße 155 x 235 mm
Themenwelt Informatik Weitere Themen CAD-Programme
Technik Elektrotechnik / Energietechnik
ISBN-10 1-4757-7366-8 / 1475773668
ISBN-13 978-1-4757-7366-8 / 9781475773668
Zustand Neuware
Haben Sie eine Frage zum Produkt?
Mehr entdecken
aus dem Bereich
Einführung in die Geometrische Produktspezifikation

von Daniel Brabec; Ludwig Reißler; Andreas Stenzel

Buch | Softcover (2023)
Europa-Lehrmittel (Verlag)
20,70