Coupled Data Communication Techniques for High-Performance and Low-Power Computing (eBook)

Ron Ho, Robert Drost (Herausgeber)

eBook Download: PDF
2010 | 2010
XVI, 206 Seiten
Springer US (Verlag)
978-1-4419-6588-2 (ISBN)

Lese- und Medienproben

Coupled Data Communication Techniques for High-Performance and Low-Power Computing -
Systemvoraussetzungen
149,79 inkl. MwSt
  • Download sofort lieferbar
  • Zahlungsarten anzeigen
Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a ?aw. If such ?aws were the result only of dust one might reduce their numbers, but ?aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce statistical variations in both the number of photons de?ning each tiny shape and the number of atoms providing the electrical behavior of tiny transistors. No known way exists to eliminate such statistical variation, nor may any be possible.
Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a ?aw. If such ?aws were the result only of dust one might reduce their numbers, but ?aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce statistical variations in both the number of photons de?ning each tiny shape and the number of atoms providing the electrical behavior of tiny transistors. No known way exists to eliminate such statistical variation, nor may any be possible.

to Coupled Data Technologies.- Overview of 3D Technologies.- Power delivery, signaling and cooling for 2D and 3D integrated systems.- Coupled Data Technologies.- Capacitive Coupled Communication.- Inductive Coupled Communications.- Use of AC Coupled Interconnect in Contactless Packaging.- Enabling Coupled Data Technologies.- Aligning chips face-to-face for dense capacitive communication.- Extending Data Coupling Technologies.- Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication.- AC Coupled Wireless Power Delivery.

Erscheint lt. Verlag 3.6.2010
Reihe/Serie Integrated Circuits and Systems
Integrated Circuits and Systems
Zusatzinfo XVI, 206 p. 183 illus.
Verlagsort New York
Sprache englisch
Themenwelt Informatik Weitere Themen Hardware
Technik Elektrotechnik / Energietechnik
Technik Nachrichtentechnik
Schlagworte chip packaging • Communication • Complexity • coupled data communication • Drost • High-Performance • HO • Integrated circuit • Integrated Circuits • Interconnect • Low-Power • Manufacturing • Modeling • Signal
ISBN-10 1-4419-6588-2 / 1441965882
ISBN-13 978-1-4419-6588-2 / 9781441965882
Haben Sie eine Frage zum Produkt?
PDFPDF (Wasserzeichen)
Größe: 50,3 MB

DRM: Digitales Wasserzeichen
Dieses eBook enthält ein digitales Wasser­zeichen und ist damit für Sie persona­lisiert. Bei einer missbräuch­lichen Weiter­gabe des eBooks an Dritte ist eine Rück­ver­folgung an die Quelle möglich.

Dateiformat: PDF (Portable Document Format)
Mit einem festen Seiten­layout eignet sich die PDF besonders für Fach­bücher mit Spalten, Tabellen und Abbild­ungen. Eine PDF kann auf fast allen Geräten ange­zeigt werden, ist aber für kleine Displays (Smart­phone, eReader) nur einge­schränkt geeignet.

Systemvoraussetzungen:
PC/Mac: Mit einem PC oder Mac können Sie dieses eBook lesen. Sie benötigen dafür einen PDF-Viewer - z.B. den Adobe Reader oder Adobe Digital Editions.
eReader: Dieses eBook kann mit (fast) allen eBook-Readern gelesen werden. Mit dem amazon-Kindle ist es aber nicht kompatibel.
Smartphone/Tablet: Egal ob Apple oder Android, dieses eBook können Sie lesen. Sie benötigen dafür einen PDF-Viewer - z.B. die kostenlose Adobe Digital Editions-App.

Buying eBooks from abroad
For tax law reasons we can sell eBooks just within Germany and Switzerland. Regrettably we cannot fulfill eBook-orders from other countries.

Mehr entdecken
aus dem Bereich